Fabrication of long length Bi-2223 superconductor tape using continuous electrophoretic deposition on round and flat substrates

Woolf, L. D.; Figueroa, T. L.; Olstad, R.A.; Elsner, F. E.; Ohkawa, T.

doi:10.1007/bf02652985

Cited by 7 publications

(1 citation statement)

References 6 publications

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“…3,4 Applications of EPD for materials process have widely been introduced in the processing of phosphor screens, [3][4][5][6][7][8][9][10][11][12] the coating of ceramics 13,14 and the fabrication of superconducting tapes. 15 Recently, applications of EPD have been extended to fuel cell applications 16,17 and the fabrication of electrodes for Li batteries. 18 Advantages of EPD include its low cost, the fact that EPD is a relatively fast and reproducible process, and its potential for use in continuous processing.…”

Section: ͓1͔mentioning

confidence: 99%

Adhesion Improvement of Phosphor Layer by Combining Electrophoretic Deposition and UV Curing

Yum

Choi²,

Sung

2003

J. Electrochem. Soc.

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Electrophoretic deposition of a phosphor layer was examined in order to improve the adhesion strength of phosphor particles using (Y 0.964 Eu 0.036 ) 2 O 3 . A considerable level of improvement in adhesion strength between phosphor particles ͑and substrate͒ was obtained when an ultraviolet ͑UV͒ curing process was used instead of water inclusion and/or postannealing. An aqueous solution of polyvinyl alcohol and ammonium dichromate was coated by spraying onto the electrophoretically deposited phosphor layer followed by curing under UV light for cross-linking. Based upon photoluminescence and scanning electron microscope studies, little optical and structural changes in the phosphor layer were found as a result of optimized amount of the curing agents and UV exposure.

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