Fabrication of Micro-Sized Copper Columns Using Localized Electrochemical Deposition with a 20 μm Diameter Micro Anode

Wang, Fuliang; Bian, Hailiang; Xiao, Yufei

doi:10.1149/2.0111903jss

Cited by 12 publications

(9 citation statements)

References 25 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Wang et al. [ 43 ] suggested a direct relationship between the morphology and the applied voltage, yet in our study, we observe a wide range of morphologies for a single voltage difference, both in LECD and HLECD. We find from our experiments two primary culprits for these irregularities.…”

Section: Discussioncontrasting

confidence: 66%

“…The surface morphology (the "blobby" nature of the surface, as clearly evident in Figure 4a) remains irregular and somewhat inconsistent throughout the printing process. Wang et al [43] suggested a direct relationship between the morphology and the applied voltage, yet in our study, we observe a wide range of morphologies for a single voltage difference, both in LECD and HLECD. We find from our experiments two primary culprits for these irregularities.…”

Section: Discussioncontrasting

confidence: 64%

See 1 more Smart Citation

Additive Manufacturing of Multi‐Metal Microstructures by Localized Electrochemical Deposition Under Hydrodynamic Confinement

Widerker,

Kaigala,

Bercovici

2023

Adv Materials Technologies

View full text Add to dashboard Cite

This study presents a device and method for multi‐metal printing of microscale structures. The method is based on combining hydrodynamic confinement of electrolytes with localized electrochemical deposition (HLECD), allowing rapid switching of the deposited metal. The device used in HLECD integrates a micro‐anode on a vertical microfluidic chip containing two open‐ended channels that control the flow of electrolytes surrounding the anode. When placed on top of a conducting surface, a localized electrochemical reaction is initiated, wherein the deposited metal composition is dictated by the electrolyte in the confinement. A range of electrolytes, which are used to deposit copper, tin, silver, and nickel, are used to fabricate multiple structures involving more than 60 material changes within a single printing process. The structures are analyzed using electron microscopy, showing the ability to achieve sharp transitions between pure metals. The constant replenishment of electrolytes also eliminates the problem of ion depletion commonly occurring in localized electrochemical deposition, and enables printing rates that are nearly an order of magnitude greater.

show abstract

Section: Discussioncontrasting

confidence: 66%

Section: Discussioncontrasting

confidence: 64%

Additive Manufacturing of Multi‐Metal Microstructures by Localized Electrochemical Deposition Under Hydrodynamic Confinement

Widerker,

Kaigala,

Bercovici

2023

Adv Materials Technologies

View full text Add to dashboard Cite

show abstract

“…[20,21] Wang et al studied the effect of applied potential on the structure and morphology changes of copper pillars during electrodeposition and proposed that high voltage leads to complex structures and morphology, which is crucial for MEMS and semiconductor-related applications. [22] Chen et al studied the influence of microtubule diameter, bias voltage, and electrolyte concentration on the deposition results by establishing a mathematical model and using the method of multiphysical field simulation. At the same time, they monitored the ion current in the electrodeposition process to judge the contact point and manufacturing quality.…”

Section: Introductionmentioning

confidence: 99%

Prediction of Deposition Rate in Meniscus‐Confined Electrodeposition Based on Parameter Optimization Algorithm

Wang

Ren

et al. 2023

Adv Eng Mater

View full text Add to dashboard Cite

Meniscus‐confined electrodeposition (MCED) is a potential approach to fabricate 3D metallic microstructures and can be used in microelectromechanical systems, optoelectronics, and flexible electrical interconnections. However, deposition efficiency and the quality of the microstructures obtained by this method on optimal parameters are identified by a large number of comparative experiments, resulting in high cost and inefficient practices. For this reason, herein, the fabrication process of metal microstructures by MCED simulation and optimizes parameters affecting deposition quality and rate is investigated. First, the finite‐element method is used to simulate the voltage and copper ion concentration identifies the target range. Then, the electrodeposition rate 1 × 10−7 m s−1 is set as the target value. The best applicable values of 0.29 V and 0.46 m are obtained after optimizing the voltage and copper ion concentration that affects the quality of deposited microstructures and rate of MCED based on the genetic algorithm (GA), cuckoo search (CS) algorithm, and support vector regression (SVR) algorithm. Finally, simulations and experiments are carried out according to the optimized parameters values. The results show that the maximum error of deposition rate is 7.9%. This study pioneers a new approach to achieving efficient and high‐quality deposition by MCED.

show abstract

“…However, most of the aforementioned studies have focused on column deposition [30] and the production of extended structures [31]. In 2000, Johansson et al used LECD to prepare a nickel column and deposited a portal made by bridging two separately built structures [32], but the joining structure was not fully formed.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of an X-shaped micro-copper structure containing a merging joint based on localized electrochemical deposition

Wang

Pan

Tian

et al. 2023

J. Micromech. Microeng.

View full text Add to dashboard Cite

Local electrochemical deposition (LECD) has proved to be an efficient and economical method for fabricating three-dimensional (3D) micron structures. Realizing complex structures that join up when deposited using LECD has been complex; therefore, the fabrication of an X-shaped joining structure was investigated in this study. A horizontal trace model was proposed, and the effects of the number of deposition layers and the horizontal sweep width on the merging joint were studied. The horizontal trace model could complete the merging joint. Multiple deposition layers and a large horizontal sweep width could stabilize and better connect the X-shaped structure containing merging joints. The merging mechanism of the X-shaped structure was also investigated using COMSOL. The stable deposition of the joining structure enables the LECD method to have a broader range of applications in micro-nano manufacturing.

show abstract

Fabrication of Micro-Sized Copper Columns Using Localized Electrochemical Deposition with a 20 μm Diameter Micro Anode

Cited by 12 publications

References 25 publications

Additive Manufacturing of Multi‐Metal Microstructures by Localized Electrochemical Deposition Under Hydrodynamic Confinement

Additive Manufacturing of Multi‐Metal Microstructures by Localized Electrochemical Deposition Under Hydrodynamic Confinement

Prediction of Deposition Rate in Meniscus‐Confined Electrodeposition Based on Parameter Optimization Algorithm

Fabrication of an X-shaped micro-copper structure containing a merging joint based on localized electrochemical deposition

Contact Info

Product

Resources

About