Soft lithography offers a convenient set of methods for the transfer of patterns to planar and nonplanar
substrates. Microelectrodeposition can transform thin metal patterns into self-supporting microstructures,
weld components together, and strengthen microstructures after deformations. Together, soft lithography
and electrochemistry provide synergistic technologies and the basis for a strategy for converting planar
patterns into three-dimensional (3D) microstructures with complex topologies. This strategy is illustrated
in the formation of folded tetrahedra, square-based pyramids, cylinders with joints, “pop-up” cubes, and
linked chains and knots.