2005
DOI: 10.1016/j.snb.2004.12.069
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Fabrication of microchip electrophoresis devices and effects of channel surface properties on separation efficiency

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Cited by 38 publications
(31 citation statements)
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“…21,22 To make the three-layer microchip by thermal bonding, there are two aspects that should be taken into account. The bonding temperature should be lowered as much as possible to avoid fractures in the metal microelectrode.…”
Section: Two-step Bonding Processmentioning
confidence: 99%
“…21,22 To make the three-layer microchip by thermal bonding, there are two aspects that should be taken into account. The bonding temperature should be lowered as much as possible to avoid fractures in the metal microelectrode.…”
Section: Two-step Bonding Processmentioning
confidence: 99%
“…For example, in a comparison of capillary electrophoresis chips made of single materials vs. bonded dissimilar materials, the singlematerial devices performed better. 36 In this article, we detail the advantages offered by glass and silicon and suggest a framework for selecting fabrication processes. We also describe key considerations for designing a glass and/or silicon process flow.…”
Section: The Remaining Advantages Of Silicon and Glassmentioning
confidence: 99%
“…However, polymer capillaries could potentially be an attractive alternative to fused silica ones because of the inertness or different surface chemistry of their inner wall. But so far these materials have been rarely used in the production of CE microfluidic devices [14][15][16]. Over the last ten years only a few papers have been published on the employment of polyether ether ketone (PEEK) [17][18][19], PMMA [17,18], PTFE [20,21] and other organic polymer materials [22,23] as column material in CE.…”
Section: Introductionmentioning
confidence: 99%