Microelectrodes have been extensively implanted into patients' deep brain for longterm treatments of nervous system disorders, and Pt and PtIr are the preferred materials for the microelectrode fi lm and microwire, respectively, because of their biocompatibility. A novel method of microwire bonding for connecting Pt 90 Ir 10 microwires to the microelectrode is presented in this paper. After the microelectrode was fabricated through microelectromechanical systems (MEMS) techniques, the Pt 90 Ir 10 microwire was connected to the microelectrode by electroplating Pt fi lm on the microwires fi xed on the connection pads of the microelectrode, instead of using a traditional bonding or soldering process. Optical photomicrography and scanning electron microscopy (SEM) revealed that the Pt 90 Ir 10 microwire was connected tightly to the microelectrode by electroplating. The measured tensile strengths of the microwire connections reached up to 0.375 MPa for the Pt fi lm with a thickness of 3 μm and above, and the maximum tensile force that the microwire (75 μm diameter) could withstand was about 1.6 N. Experimental results indicated that the electroplating connection could provide suffi cient strength for the microelectrode to accurately reach the target position in the deep brain.