Fabrication of Microstructure Arrays via Localized Electrochemical Deposition

Abstract

Localized electrochemical deposition microadditive manufacturing (AM) (LECD-µAM) technology represents a nontraditional manufacturing method applied for the layer-by-layer fabrication of metal microstructures via a fully automatic feedback mechanism. In terms of material utilization and complex structure formation, the proposed technology exhibits great potential for microstructure fabrication. The LECD-µAM technology introduced in this study involves the reduction of metal cations in the electrolyte to form metal microstructures. This study showed the flow simulation of an electrolyte in the cantilever probe and pressure distribution at the probe tip. In addition, the effect of extrusion pressure on the deposition structure was investigated experimentally. Combined with the experimental results, we discussed the effects of LECD-µAM technology on deposition outcomes and optimized parameters and designed a printing route for the deposition of complex metal microstructure arrays with smooth surfaces. The proposed technology attained a deposition rate and a microstructural copper content of 0.961 µm/s and 99.5%. In addition, LECD-µAM technology can be performed at room temperature, has low environmental requirements and cost, provides a good deposition surface, and holds great potential for the manufacture of three-dimensional and other complex microstructure arrays.