2010 Photonics Global Conference 2010 Help me understand this report
Fabrication of ordered metal nano-particles on a quantum well structure
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“…The impurities in the alloy may lead to irregular lattice; in order to remove the impurities, 1 µm thick copper layer was deposited by physical vapour deposition (PVD) prior to the electroplated nickel. Nickel can also be changed to other metals to realize different functionalities 32 . After this step the aluminium substrate was dissolved by chemical dissolving in order to reveal the Ni master with the negative surface structure 33 .…”
Section: Process Chain 3: Anodizing and Etching Processmentioning
confidence: 99%
“…The impurities in the alloy may lead to irregular lattice; in order to remove the impurities, 1 µm thick copper layer was deposited by physical vapour deposition (PVD) prior to the electroplated nickel. Nickel can also be changed to other metals to realize different functionalities 32 . After this step the aluminium substrate was dissolved by chemical dissolving in order to reveal the Ni master with the negative surface structure 33 .…”
Section: Process Chain 3: Anodizing and Etching Processmentioning
confidence: 99%
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