2010
DOI: 10.1088/0957-4484/21/7/075301
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Fabrication of planar organic nanotransistors using low temperature thermal nanoimprint lithography for chemical sensor applications

Abstract: A new fabrication process for the patterning of organic semiconductors at the nanoscale has been developed using low temperature thermal nanoimprint lithography and the details of this process are discussed. Novel planar nanotransistors have been fabricated and characterized from poly(3-hexylthiophene) (P3HT) and we demonstrate the feasibility of using such devices as highly sensitive chemical sensors.

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Cited by 25 publications
(12 citation statements)
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“…As such, they do not require registration between different layers. The whole SSD arrays can be structured in a single step of nanolithography with high yields, using for instance high‐throughput nanoimprint techniques . Importantly, integration of SSD arrays with planar organic transistors is straightforward and allows relatively easy fabrication of polymer semiconductor circuits.…”
Section: Discussionmentioning
confidence: 99%
“…As such, they do not require registration between different layers. The whole SSD arrays can be structured in a single step of nanolithography with high yields, using for instance high‐throughput nanoimprint techniques . Importantly, integration of SSD arrays with planar organic transistors is straightforward and allows relatively easy fabrication of polymer semiconductor circuits.…”
Section: Discussionmentioning
confidence: 99%
“…Different imprint pressure situation was simulated. At 1×10 5 Pa, the resist does not fill the cavity of the stamp. At 1×10 8 Pa, the resist only partly fill the cavity.…”
Section: Temperature's Impact On Resist Stressmentioning
confidence: 99%
“…However, traditional thermal nanoimprint lithography (TNIL) needs high temperature, which needs long process time and increase thermal stress [3]. Therefore, it is necessary to conduct research on low temperature nanoimprint lithography (LTNIL) [4,5]. In LTNIL process, the resist is heated to a temperature just beyond the polymer's glass transition temperature (T g ).…”
Section: Introductionmentioning
confidence: 99%
“…The fabrication of a large number of SSDs in a single lithography step, without the need for interconnection layers, can be realized due to the planar architecture of the device, which subsequently helps to avoid introducing undesirable parasitic elements . This main feature of SSD therefore not only makes the entire fabrication process simpler, faster, and at lower cost in comparison with other conventional electronic devices, but also allows the manufacturing of SSDs with large‐area fabrication techniques, such as nanoimprinting lithography , which can further reduce the whole production cost.…”
Section: Introductionmentioning
confidence: 99%