Fabrication of PZT Composite Thick Films for High Frequency Membrane Resonators

Duval, Fabrice; Dorey, Robert; Wright, Robert V.; Huang, Zhaorong; Whatmore, R. W.

doi:10.1007/s10832-004-5110-2

Cited by 4 publications

(4 citation statements)

References 6 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Damping ratio was calculated as 0.00121 by Blom's equation [8]. Electromechanical coupling coefficient was determined as 0.058 by experiment as in Duval's study [9]. R op is optimum resistance for maximum power, calculated by equation (6).…”

Section: Modelingmentioning

confidence: 99%

Fabrication and analytical modeling of transverse mode piezoelectric energy harvesters

et al. 2012

View full text Add to dashboard Cite

A transverse (d 33 ) mode piezoelectric cantilever was fabricated for energy harvesting. Various dimensions of interdigital electrodes (IDE) were deposited on a piezoelectric layer to examine the effects of electrode design on the performance of energy harvesters. Modeling was performed to calculate the output power of the devices. The estimation was based on Roundy's analytical modeling derived for a d 31 mode piezoelectric energy harvester (PEH). In order to apply the Roundy's model to d 33 mode PEH, the IDE configuration was converted to the area of top and bottom electrodes (TBE). The power conversion in d 33 mode PEH was commonly estimated by the product of piezoelectric layer's thickness and finger electrode's length. In addition, the spacing between fingers was regarded as gap between top and bottom electrodes. However, the output power in a transverse mode PEH increases continuously with the increase of finger spacing, which does not correspond to experimental results. In this research, the dimension of IDE was converted to that of TBE using conformal mapping, and variation of power of PEH was remodeled. The modified model suggests that the maximum power in a transverse mode PEH is obtained when the finger spacing is identical with effective finger spacing. The output power then decreases when finger spacing is larger than effective finger spacing. The decrease of efficiency may result from insufficient degree of poling and increased charged defect with increasing finger spacing.

show abstract

Section: Modelingmentioning

confidence: 99%

Fabrication and analytical modeling of transverse mode piezoelectric energy harvesters

et al. 2012

View full text Add to dashboard Cite

show abstract

“…13 FEA results of the bending stress of a multilayer microcantilever fabricated from gold and SU8. A force of 1.64 lN is applied at the freeend of cantilever and produces a bending deflection of 1.25 lm The micromembranes are MEMS components that accomplish one double role of supporting other components, which are regularly rigid, and providing the necessary flexibility in a microdevice that has moving parts (Lobontiu and Garcia 2004;Pustan and Rymuza 2007a, b;Duval et al 2003). Micromembranes have their thickness much smaller that the in-plane dimensions.…”

Section: Modeling and Finite Element Analysis Of Multilayer Microcantmentioning

confidence: 99%

Modeling and finite element analysis of mechanical behavior of flexible MEMS components

Pustan

Paquay²,

Rochus

et al. 2011

Microsyst Technol

View full text Add to dashboard Cite

This paper describes the studies of the mechanical characteristics of flexible MEMS components including theoretical approaches, finite element analysis and experimental investigations. Modeling and finite element analyses together with theoretical and experimental investigations are performed to estimate the elastic behavior of MEMS components as microcantilevers, microbridges and micromembranes. Finite element analysis of microcomponents deflections under different loading and the stress distribution in beams are determined and compared with the experimental measurements performed using an atomic force microscope. The modeling of a micromembrane supported by four hinges that enable out-ofplane motion is presented. Finite element analysis and experimental investigations are performed to visualize the deflection of the mobile part of the micromembrane under an applied force and the stress distribution in hinges. In additional, this paper provides analytical relations to compute the stiffness and the stress of the investigated flexible MEMS components.

show abstract

“…After drying the resist was dissolved before sintering and structures with a height of 3 μm and a width down to 7 μm could be made. However, in a typical ultrasonic transducer operating in thickness mode the PZT thick film must have a thickness often higher than 10 μm [38]. There are very few resist types that can be made very thick using only one coating.…”

Section: Introductionmentioning

confidence: 99%

Novel patterning of composite thick film PZT

2007

Self Cite

View full text Add to dashboard Cite

There is a clear need for thick PZT films (10-100 μm) in micro-electromechanical systems (MEMS). Some applications, like high frequency transducers operating in the thickness mode, require frequencies in the MHz region and thus thicker films, which in addition will provide more power. Thicker films are also important in actuator systems and sensors as it will generate more force and voltage, respectively. Integration of complex structures of thick films in thick films in MEMS is challenging. The use of normal thin film patterning techniques is difficult for thick films due to the amount of material that has to be removed and the isotropic nature of wet etching. A new patterning technique suitable for composite thick films using an epoxy mould is presented. By filling a micro mould of SU-8 photoresist with PZT paste details down to 20 μm with vertical feature walls could be patterned in a 15 μm thick film.

show abstract

Fabrication of PZT Composite Thick Films for High Frequency Membrane Resonators

Cited by 4 publications

References 6 publications

Fabrication and analytical modeling of transverse mode piezoelectric energy harvesters

Fabrication and analytical modeling of transverse mode piezoelectric energy harvesters

Modeling and finite element analysis of mechanical behavior of flexible MEMS components

Novel patterning of composite thick film PZT

Contact Info

Product

Resources

About