Fabrication of rigid polyimide foams by adopting active crosslinking strategy

Luo, Yinfu; Ni, Long; Shen, Lu; Sun, Tong; Liang, Mei; Liu, Pengbo; Zou, Huawei; Zhou, Shengtai

doi:10.1016/j.polymer.2022.125220

Cited by 10 publications

(5 citation statements)

References 46 publications

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“…It was worth mentioning that the peak intensity at 2605 cm −1 was significantly decreased in PEAS M6D4 ‐130 (i.e., PEAS M6D4 treated at 130 °C), implying that COONH 3 was converted to CONH during the heating process. [ 5,43 ] When the temperature was heated to 300 °C, PIF M6D4 yielded characteristic peaks near 1775, 1715, 1370, and 713 cm −1 , which were related to the asymmetric and symmetric stretching of CO in imide rings, C‐N and imide rings, suggesting the successful formation of imide structure. In addition, characteristic peaks centering at 2920, 2854, and 1510 cm −1 corresponded to the asymmetric and symmetric stretching vibration of C–H and benzene rings.…”

Section: Resultsmentioning

confidence: 99%

“…[1] Thus, PIF bears the characteristics of PI resin and porous material, exhibiting exceptional thermal resistance, flame-retardant, self-extinguishing, irradiation resistance, thermal insulation, cushioning, and vibration-damping properties. [2][3][4][5][6][7] As a result, it has been extensively employed in the fields of aerospace and aeronautics, submarine, transportation, and microelectronics. [8][9][10][11] For example, the common application fields for PIFs include insulation material for rocket fuel storage tanks, thermal and sound DOI: 10.1002/marc.202300357 insulation for submarines as well as structural core materials for advanced composite materials.…”

Section: Introductionmentioning

confidence: 99%

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Fabrication of Lightweight Polyimide Foams with Exceptional Mechanical and Thermal Properties

Tian,

Luo,

Meng

et al. 2023

Macromol. Rapid Commun.

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Lightweight polyimide foams (PIFs) with exceptional thermal resistance and compressive properties were fabricated by heating polyester ammonium salts (PEASs) which were prepared by co‐polymerizing 4, 4’‐diaminobenzanilide (DABA), 4, 4’‐diaminodiphenyl methane (MDA) and 3, 3’, 4, 4’‐benzophenone tetracarboxylic dianhydride (BTDA). Hydrogen bonds were formed between CONH and C = O in the PI chains due to the addition of DABA and the melt viscosity of PEAS precursors increased with increasing content of DABA, which was advantageous to bind the foaming gases for cell expansion. The expansion ratio of PEAS precursors was increased from 633% to 1133% when the molar ratio of MDA/DABA was changed from 10:0 to 6:4. The compressive strength and modulus of PIFM9D1 (i.e., the molar ratio of MDA/DABA was 9:1, foam density: 120.8 kg·m−3) reached as high as 0.59 and 15.0 MPa, respectively. The PIFs possessed prominent thermal performance with the initial thermal degradation temperatures (under both nitrogen and air atmosphere) and glass transition temperatures (as assessed by DSC and DMA) exceeding 511 and 292 °C, respectively. The thermal conductivity of PIFs was lower than 0.049 W·m−1·K−1, which exhibited promising applications for serving as high‐temperature thermal insulation materials in the fields of aerospace, marine, and nuclear sectors among others.This article is protected by copyright. All rights reserved

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Section: Resultsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Fabrication of Lightweight Polyimide Foams with Exceptional Mechanical and Thermal Properties

Tian,

Luo,

Meng

et al. 2023

Macromol. Rapid Commun.

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“…Compared to powder foaming and isocyanate foaming, microsphere foaming demonstrates advantages of being lightweight and possessing excellent mechanical properties and cell size regulation. , In preliminary research, PI hollow microspheres were fabricated by gradient heating and microsphere foaming processes. The sizes of PI hollow microspheres ranged from 295.5 to 1479 μm and could be modulated through controlling the PEAS size . Except for cell size, carbon structure is an important factor influencing EMI shielding properties.…”

Section: Introductionmentioning

confidence: 99%

“…The sizes of PI hollow microspheres ranged from 295.5 to 1479 μm and could be modulated through controlling the PEAS size. 36 Except for cell size, carbon structure is an important factor influencing EMI shielding properties. Chen et al fabricated CFs by wood-pulp fabric matting, and results showed that the EMI shielding properties were closely related to the graphitization; the I G /I D values increased from 0.33 to 0.61 when the carbonization temperature increased from 800 to 1500 °C, and the EMI SE was up to 40 dB.…”

Section: Introductionmentioning

confidence: 99%

Lightweight, Robust, and Multifunctional Polyimide-Based Carbon Foams for Electromagnetic Interference Shielding and Thermal Insulation

Wang,

Zhou,

et al. 2024

Ind. Eng. Chem. Res.

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Polyimide (PI)-based carbon foams (CFs) with excellent compressive strength, thermal insulation, and electromagnetic interference (EMI) shielding properties were fabricated through microsphere foaming and carbonization processes. The cell size of CFs ranged from 207.8 to 563.9 μm and could be regulated by adjusting the size of polyester ammonium salts (PEASs), and the chemical structure depended on the carbonization temperature. The compressive strength of C 1100 -PIF-1 was 0.74 MPa with a density of 119.9 kg•m −3 . The thermal conductivities of C 800 -PIF-1 at room temperature, 500, and 1000 °C were 0.126, 0.202, and 0.252 W•m −1 K −1 , respectively. Furthermore, CFs exhibited excellent EMI shielding properties, with C 1100 -PIF-2 and C 1100 -PIF-3 reaching 56.4 and 42.1 dB at 8.2−12.4 GHz. The electrical conductivity fell in the range of 5.5−38.5 S•m −1 . The CFs fabricated in this work, which combined exceptional mechanical strength, thermal insulation, and EMI shielding properties, had potential applications in aerospace, high-temperature insulation, and chemical catalysis.

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“…At present several brands of industrial polyimides are known, such as Ultem, Kapton, P84 and some others. These industrial polyimides are used to make high-strength and heatresistant films, fibers, electrical insulation, structural parts and filtration membranes [15][16][17][18][19]. Properties of commercially available polyimides are insufficient for obtaining a number of special polymeric materials.…”

Section: Introductionmentioning

confidence: 99%

Prospects for the synthesis and application of copolyimides based on tetracarboxylic acid dianhydride mixtures

Kuleznev,

Zhukova,

Storozhuk

et al. 2023

E3S Web of Conf.

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The process of obtaining copolyimides by polycondensation based on 3,6-diaminoacridine, 9,9-bis-(p-aminophenyl)fluorene, dianhydride of 2,2-bis-(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane and dianhydride of 3,3',4,4'-tetracarboxydifenyloxide are described. The main physico-chemical properties of the obtained products are discussed and the prospects for the use of these soluble and fusible products as a polymer base for the preparation of composite materials are shown.

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Fabrication of rigid polyimide foams by adopting active crosslinking strategy

Cited by 10 publications

References 46 publications

Fabrication of Lightweight Polyimide Foams with Exceptional Mechanical and Thermal Properties

Fabrication of Lightweight Polyimide Foams with Exceptional Mechanical and Thermal Properties

Lightweight, Robust, and Multifunctional Polyimide-Based Carbon Foams for Electromagnetic Interference Shielding and Thermal Insulation

Prospects for the synthesis and application of copolyimides based on tetracarboxylic acid dianhydride mixtures

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