Printing electronics has led to application areas which were formerly impossible with conventional electronic processes. Solutions are used as inks on top of large areas at room temperatures, allowing the production of fully flexible circuitry. Commonly, research in these inks have focused on organic and metal-oxide ink materials due to their printability, while these materials lack in the electronic performance when compared to silicon electronics. Silicon electronics, on the other hand, has only recently found their way in solution processes. Printing of cyclopentasilane as the silicon ink has been conducted and devices with far superior electric performance have been made when compared to other ink materials. A thermal annealing step of this material, however, was necessary, which prevented its usage on inexpensive substrates with a limited thermal budget. In this work, we introduce a method that allows polycrystalline silicon (poly-Si) production directly from the same liquid silicon ink using excimer laser irradiation. In this way, poly-Si could be formed directly on top of paper even with a single laser pulse. Using this method, poly-Si transistors were created at a maximum temperature of only 150C. This method allows silicon device formation on inexpensive, temperature sensitive substrates such as polyethylene terephthalate, polyethylene naphthalate or paper, which leads to applications that require low-cost but high-speed electronics. Printing electronics has aroused great interest in recent years in view of the low-cost manufacturability of electronic devices as well as the simplicity when compared to conventional device processing methods that require lithography and vacuum systems. Semiconductors printed as inks on arbitrary substrates have led to applications that were formerly impossible such as rollable displays or flexible bio-sensing systems. Semiconducting inks commonly researched in this field are organic and metal-oxide semiconductors.1-6 These materials have also found their way on paper substrates by using low temperature fabrication methods.7-9 These semiconductors, however, lack in their field-effect mobilities and reliability when compared to silicon. Silicon inks have also been investigated in recent years using cyclopentasilane (CPS); a silicon precursor which is liquid at room temperature and can transform into solid silicon by curing the ink to a polysilane and CPS sol-gel with ultraviolet (UV) light, causing the CPS ring-molecules to open and connect end-toend. 10 The polysilane chains cross-link with each other when heated to a temperature of at least 350 C forming hydrogenated amorphous silicon (a-Si:H). A following excimer laser irradiation can transform the amorphous silicon (a-Si) film into polycrystalline silicon (poly-Si), a common method for silicon crystallization. Using this silicon ink, a-Si solar cells have been created, 11 as well as poly-Si thin-film transistors (TFTs) with mobilities that were more than 100 times higher than TFTs made from organic and metal-oxide inks....