“…Typical conventional EBL fabrication processes include thin film growth, resist coating, e-beam exposure, resist development, and reactive ion etching (RIE). ,,, In the overall process, lithography applies a focused electron beam to scan the resist (e.g., poly(methyl methacrylate) and hydrogen silsesquioxane), the developing process utilizes specific developers to create nanoscale patterns in the resist, and RIE transforms the resist patterns to a thin film . Generally, both the development and RIE processes involve harmful organics (e.g., methyl isobutyl ketone, N -methylpyrrolidone, and acetone) or toxic gases (e.g., CF 4 , SF 6 , CHF 3 , HBr, BCl 3 , and SiCl 4 ), which not only harm the environment and humans but also damage the quality of the samples, especially in the field of producing micro/nanodevices. , …”