2019
DOI: 10.1007/s00542-019-04388-1
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Fabrication of surface micromachined molybdenum cantilever beams for PWM MEMS pressure sensor and issues that affect yield

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Cited by 9 publications
(3 citation statements)
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“…Printing or coating processes can provide the low-cost fabrication of flexible, large-area electronic devices, compared to MEMS 29,30 or semiconductor processes. 31,32 Air-gap structures are often found in MEMS touch sensors 33,34 and they are designed to sense external force by detecting deformation of a component placed on the air-gap. In general, air-gap structures are fabricated by the etching process in MEMS fabrication.…”
Section: ■ Introductionmentioning
confidence: 99%
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“…Printing or coating processes can provide the low-cost fabrication of flexible, large-area electronic devices, compared to MEMS 29,30 or semiconductor processes. 31,32 Air-gap structures are often found in MEMS touch sensors 33,34 and they are designed to sense external force by detecting deformation of a component placed on the air-gap. In general, air-gap structures are fabricated by the etching process in MEMS fabrication.…”
Section: ■ Introductionmentioning
confidence: 99%
“…Air-gap structures are often found in MEMS touch sensors , and they are designed to sense external force by detecting deformation of a component placed on the air-gap. In general, air-gap structures are fabricated by the etching process in MEMS fabrication.…”
Section: Introductionmentioning
confidence: 99%
“…Capacitive acceleration sensors can have a cantilever [ 20 , 21 ], sandwich [ 22 , 23 ] or comb [ 24 , 25 ] structure and the structures are made to contain an air gap. Air gaps are commonly formed by etching in MEMS [ 26 , 27 ]. When an acceleration occurs in a capacitive acceleration sensor, the mass placed on or beside the air gap moves in the opposite direction of the acceleration by inertia.…”
Section: Introductionmentioning
confidence: 99%