Temperature‐independent properties are critical for high‐temperature thin‐film strain gauges (TFSGs). In this study, by controlling the electron scattering and tunneling effects in the TiB2/SiCN composites, the environmental interference of temperature fluctuations was successfully eliminated, and a temperature‐independent TFSG was fabricated. The effects of pyrolysis temperature and TiB2 content on the microstructural evolution and electrical properties of the ceramic films were studied. The temperature insensitivity was mainly attributed to the balance between the intrasheet resistance with a positive temperature coefficient of resistance (TCR) and the intersheet resistance with a negative TCR. This composite showed nearly constant resistance values over an ultra‐wide temperature range of 300–700 °C, with less than 0.05% deviation of the normalized resistance and TCR values as low as 1.6 ppm/°C. In addition, the TiB2/SiCN films exhibited stable piezoresistive responses, with a gauge factor of 4.28, and the temperature‐independent strain response in the high temperature range was verified.This article is protected by copyright. All rights reserved.