Fabrication of Thin Film Capacitors Embedded in Flexible Polymer by SAM Transfer Methods

Amano, Yuki; Byun, Ikjoo; Kim, Beom Joon; Ichiki, Masaaki

doi:10.1541/ieejsmas.135.118

Cited by 1 publication

(1 citation statement)

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“…Therefore, fundamental studies have been carried out on nanotransfer method, in which a material formed on a heat‐resistant substrate is peeled off and transferred to a resin substrate, and it was revealed that the effect of atomic diffusion on its adhesion to the base material . Furthermore, by taking advantage of the nanotransfer method as a processing technology, self‐assembled monolayer (SAM) transfer method, a dry peel‐off process , was introduced as a contaminant‐free transferring technique to a flexible polydimethylsiloxane (PDMS) resin substrate . A PZT thin film capacitor was fabricated on a silicon substrate via metal organic decomposition (MOD) , and was surface‐modified by SAM such as 3‐mercaptopropyltrimethoxysilane (MPTMS) and octadecyltrichlorosilane (OTS) for easier transfer.…”

Section: Introductionmentioning

confidence: 99%

Transfer Methods of PZT Thin Capacitor to Flexible Polymer by Self‐Assembled Monolayers

Mizuno

Byun

Kim

et al. 2016

Elect Comm in Japan

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SUMMARY This paper describes the fabrication method that a lead zirconate titanate (PZT) thin film capacitor, which is formed on a Si substrate by metal organic decomposition (MOD), can be easily transferred to flexible polymer (polydimenthylsiloxane; PDMS) without additional chemical contamination. The thin film capacitor is composed of sandwich structure of PZT between two metal layers. To embed the capacitor structure in the polymer substrate by dry peel‐off process, three kinds of self‐assembled monolayers (SAMs) were investigated for adhesion or antiadhesion layer between metal, polymer, and Si substrate, respectively. Also, the MOD's annealing process with SAMs for PZT lamination was investigated. As a result, the PZT capacitors of 1 μm thickness with a perovskite structure were successfully transferred and embedded in PDMS substrate. These results will be useful for fabricating MEMS devices and integration technology of electrical device to a polymer substrate such as capacitors in three‐dimensional integration or for flexible electronics.

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Section: Introductionmentioning

confidence: 99%