Abstract:It is difficult to fabricate three-dimensional structures using semiconductor-process technology, because it is based on two-dimensional layered structure fabrication and the etching of thin films. In this study, we fabricated metal structures that can be dynamically deformed from two-dimensional to three-dimensional shapes by combining patterning using photolithography with electroforming technology. First, a resist structure was formed on a Cu substrate. Then, using a Ni sulfamate electroforming bath, a Ni s… Show more
“…Kumamoto et al [ 7 ] introduced a technique for fabricating metal structures that could be deformed from two-dimensional to three-dimensional shapes in response to hydrodynamic forces using photolithography and electroforming. The resulting structures had an average film thickness of 12.9 µm, a hardness of 600 HV, and a slit width of 7.9 µm.…”
In recent years, the field of micromachining has gained a lot of traction owing to the drive towards lightweighting, electrification, and sustainability [...]
“…Kumamoto et al [ 7 ] introduced a technique for fabricating metal structures that could be deformed from two-dimensional to three-dimensional shapes in response to hydrodynamic forces using photolithography and electroforming. The resulting structures had an average film thickness of 12.9 µm, a hardness of 600 HV, and a slit width of 7.9 µm.…”
In recent years, the field of micromachining has gained a lot of traction owing to the drive towards lightweighting, electrification, and sustainability [...]
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