2014
DOI: 10.1016/s1003-6326(14)63502-0
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Fabrication of TiN/cBN and TiC/diamond coated particles by titanium deposition process

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Cited by 29 publications
(5 citation statements)
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“…It is due to the formation of the Ni-Cu solid solution between the copper and nickel fine powder during the sintering at 1000 C [32][33][34]. On the other hand, as reported in our previous report, the boron nitride can be interacting at high temperature with some metal matrix to form a compound layer composed of metal borides as well as metal nitrides in the interface region between the surface of the boron nitride nanoparticles and the metal matrix [14]. The formation of the compound layer is due to the in-situ transformation reaction between the metal matrix and the surface of the nanosized boron nitride particles under the high temperature during the sintering process.…”
Section: Methods Of Assessment Of Powders and Bn/20ni-cu Compositesmentioning
confidence: 80%
See 1 more Smart Citation
“…It is due to the formation of the Ni-Cu solid solution between the copper and nickel fine powder during the sintering at 1000 C [32][33][34]. On the other hand, as reported in our previous report, the boron nitride can be interacting at high temperature with some metal matrix to form a compound layer composed of metal borides as well as metal nitrides in the interface region between the surface of the boron nitride nanoparticles and the metal matrix [14]. The formation of the compound layer is due to the in-situ transformation reaction between the metal matrix and the surface of the nanosized boron nitride particles under the high temperature during the sintering process.…”
Section: Methods Of Assessment Of Powders and Bn/20ni-cu Compositesmentioning
confidence: 80%
“…Such sintering conditions are attained using ultrahigh pressure devices. In addition, when additives such as powders of Ni, Al and Cu, are added to cBN particles for solid phase sintering, their effect as sintering additives or binding materials is limited [13][14][15][16].…”
Section: Introductionmentioning
confidence: 99%
“…On the other hand, a molten salt reaction is a method that uses one or more salts with a low melting point as a reaction medium to form thin films on the surface of materials through a disproportionation reaction [18][19][20]. The molten salt reaction method has several unique characteristics-for instance, there are no special requirements for the surface roughness of the substrate material-and the bonding between the film and the substrate is firm [21].…”
Section: Introductionmentioning
confidence: 99%
“…Such sintering conditions are attained using ultrahigh pressure devices. In addition, when additives such as powders of Ni, Al and Cu, are added to cBN particles for solid phase sintering, their effect as sintering additives or binding materials is limited [13][14][15][16].…”
Section: Introductionmentioning
confidence: 99%