Fabrication of Transistors on Flexible Substrates: from Mass‐Printing to High‐Resolution Alternative Lithography Strategies

Moonen, P.; Yakimets, Iryna; Huskens, Jurriaan

doi:10.1002/adma.201202949

Cited by 271 publications

(242 citation statements)

References 166 publications

(147 reference statements)

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“…High resolution is needed for minimizing the foot print of the transistor, which is important, e.g., in flexible display applications, and for decreasing the channel length, which would lead to higher switching speeds. Traditional printing processes are limited to a resolution of a few tens of µm [13]. For smaller dimensions, special R2R-compatible methods are needed, e.g., UV-nanoimprint lithography (UV-NIL) [14] or attoliter gravure printing [15] have been demonstrated in a sheet-to-sheet (S2S) process for flexible OTFTs.…”

Section: Introductionmentioning

confidence: 99%

Self-Aligned Metal Electrodes in Fully Roll-to-Roll Processed Organic Transistors

et al. 2016

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Abstract:We demonstrate the production of organic bottom gate transistors with self-aligned electrodes, using only continuous roll-to-roll (R2R) techniques. The self-alignment allows accurate <5 µm layer-to-layer registration, which is usually a challenge in high-speed R2R environments as the standard registration methods are limited to the millimeter range-or, at best, to tens of µm if online cameras and automatic web control are utilized. The improved registration enables minimizing the overlap between the source/drain electrodes and the gate electrode, which is essential for minimizing the parasitic capacitance. The complete process is a combination of several techniques, including evaporation, reverse gravure, flexography, lift-off, UV exposure and development methods-all transferred to a continuous R2R pilot line. Altogether, approximately 80 meters of devices consisting of thousands of transistors were manufactured in a roll-to-roll fashion. Finally, a cost analysis is presented in order to ascertain the main costs and to predict whether the process would be feasible for the industrial production of organic transistors.

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Section: Introductionmentioning

confidence: 99%

Self-Aligned Metal Electrodes in Fully Roll-to-Roll Processed Organic Transistors

et al. 2016

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“…The technological process is based primarily on the sacrificial layer technology, in which the sacrificial layer is removed during the final process step, creating the self-supporting structure. The micromolding in capillaries (MIMIC) stamping technology was chosen for layer formation and simultaneous structuring of the sacrificial layer (Moonen et al, 2012). The sacrificial layer of heated, liquid paraffin wax fills a pre-structured channel network, owing to capillary action.…”

Section: Technologymentioning

confidence: 99%

Polymer composite based microbolometers

Nocke

2013

J. Sens. Sens. Syst.

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Abstract. This work focuses on the basic suitability assessment of polymeric materials and the corresponding technological methods for the production of infrared (micro-) bolometer arrays. The sensitive layer of the microbolometer arrays in question is composed of an electrically conductive polymer composite. Semiconducting tellurium and vanadium dioxide, as well as metallic silver, are evaluated concerning their suitability as conductive filling agents. The composites with the semi-conducting filling agents display the higher temperature dependence of electrical resistance, while the silver composites exhibit better noise performance. The particle alignment -homogeneous and chain-shaped alike -within the polymer matrix is characterized regarding the composites' electrical properties. For the production of microbolometer arrays, a technology chain is introduced based on established coat-forming and structuring standard technologies from the field of polymer processing, which are suitable for the manufacture of a number of parallel structures. To realize the necessary thermal isolation of the sensitive area, all pixels are realized as self-supporting structures by means of the sacrificial layer method. Exemplarily, 2 × 2 arrays with the three filling agents were manufactured. The resulting sensor responsivities lie in the range of conventional microbolometers. Currently, the comparatively poor thermal isolation of the pixels and the high noise levels are limiting sensor quality. For the microbolometers produced, the thermal resolution limit referring to the temperature of the object to be detected (NETD) has been measured at 6.7 K in the superior sensitive composite layer filled with silver particles.

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“…5,7,[17][18][19][20][21] Application of conventional NIL to produce nanostructured films on flexible substrates has a number of drawbacks, such as mechanical and thermal deformation of the substrates, 22,23 poor adhesion, 24 and incompatibility with high temperatures. 25,26 These drawbacks lead to low throughput and poor pattern uniformity in large arrays. 27,28 In addition, the conventional nanoimprint procedure usually requires an additional etching process to remove a residual polymer layer left between the imprinted structures.…”

Section: Introductionmentioning

confidence: 99%

Ferroelectric polymer nanopillar arrays on flexible substrates by reverse nanoimprint lithography

Song

Foreman

et al. 2016

J. Mater. Chem. C

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aWith the increasing interest in deploying ferroelectric polymer in flexible electronics and electromechanics, high-throughput and low-cost fabrication of 3D ferroelectric polymer nanostructures on flexible substrates can be a significant basis for future research and applications. Here, we report that large arrays of ferroelectric polymer nanopillars can be prepared directly on soft, flexible substrates by using low-cost polydimethylsiloxane (PDMS) soft-mold reverse nanoimprint lithography at 135 1C and at pressures as low as 3 bar. The nanopillar arrays were highly uniform over large areas of at least 200 Â 200 mm and had good crystallinity with nearly optimum (110) orientation. Furthermore, the method leaves little or no residual polymer layer, fully isolating the nanopillars to avoid cross-talk and, obviating the need for additional etching processes that arises with conventional low-contrast nanoimprinting. The ferroelectric properties of individual nanopillars were probed by piezoresponse force microscopy, which showed that they exhibited switchable and bi-stable polarization. In addition, the polarization hysteresis loops probed by pyroelectric measurements of the entire array showed that the nanopillar capacitor arrays had good ferroelectric switching characteristics, over areas of at least 1 mm Â 1 mm. IntroductionFerroelectric polymer nanostructures are of great interest due to their potential use in a wide range of applications, such as organic electronics, 1,2 electro-mechanics, 3,4 nonvolatile memories, [5][6][7][8] and solid-state energy storage, harvesting and conversion. [9][10][11][12] With the increasing application of ferroelectric polymers in the area of flexible electronics, [13][14][15][16] high-throughput and low-cost fabrication of uniform ferroelectric polymer nanostructures with good ferroelectric properties over large areas on flexible substrates will be a significant basis for flexible electronics applications. Previous studies of ferroelectric polymers, like polyvinylidene-co-trifluoroethylene, P(VDF-TrFE), report results from conventional nanoimprint lithography (NIL) with highcost rigid molds at high pressures ranging from 20 bar to 120 bar and 130 to 150 1C to produce ferroelectric nanostructures on hard substrates. 5,7,[17][18][19][20][21] Application of conventional NIL to produce nanostructured films on flexible substrates has a number of drawbacks, such as mechanical and thermal deformation of the substrates, 22,23 poor adhesion, 24 and incompatibility with high temperatures. 25,26 These drawbacks lead to low throughput and poor pattern uniformity in large arrays. 27,28 In addition, the conventional nanoimprint procedure usually requires an additional etching process to remove a residual polymer layer left between the imprinted structures. 29,30 This extra etching process may also be incompatible with flexible substrates due to their poor etching resistance. 31 Previous research on reverse nanoimprinting, where the material is first coated onto rigid mold and then transferred ...

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Fabrication of Transistors on Flexible Substrates: from Mass‐Printing to High‐Resolution Alternative Lithography Strategies

Cited by 271 publications

References 166 publications

Self-Aligned Metal Electrodes in Fully Roll-to-Roll Processed Organic Transistors

Self-Aligned Metal Electrodes in Fully Roll-to-Roll Processed Organic Transistors

Polymer composite based microbolometers

Ferroelectric polymer nanopillar arrays on flexible substrates by reverse nanoimprint lithography

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