2018
DOI: 10.1038/s41598-017-18637-8
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Fabrication of ultrahigh-precision hemispherical mirrors for quantum-optics applications

Abstract: High precision, high numerical aperture mirrors are desirable for mediating strong atom-light coupling in quantum optics applications and can also serve as important reference surfaces for optical metrology. In this work we demonstrate the fabrication of highly-precise hemispheric mirrors with numerical aperture NA = 0.996. The mirrors were fabricated from aluminum by single-point diamond turning using a stable ultra-precision lathe calibrated with an in-situ white-light interferometer. Our mirrors have a diam… Show more

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Cited by 8 publications
(3 citation statements)
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“…This method is based on rectangular coaxial ribbon cables attached to micro-sized pins, forming coaxial transmission lines by means of an interposer block; the tip of each pin is bonded vertically to mating pads on the quantum chip using In. The quantum chip is patterned with a square array of [5,30] µm thick circular pads made from In with d pad ∈ [100, 200] µm; the In pads can be fabricated above an underlying Al thin film, or other films. Each pad is electrically connected to an on-chip Al (or Nb) trace used to reach a qubit.…”
Section: Pin-chip Bonding For Fully Vertical Interconnectsmentioning
confidence: 99%
See 1 more Smart Citation
“…This method is based on rectangular coaxial ribbon cables attached to micro-sized pins, forming coaxial transmission lines by means of an interposer block; the tip of each pin is bonded vertically to mating pads on the quantum chip using In. The quantum chip is patterned with a square array of [5,30] µm thick circular pads made from In with d pad ∈ [100, 200] µm; the In pads can be fabricated above an underlying Al thin film, or other films. Each pad is electrically connected to an on-chip Al (or Nb) trace used to reach a qubit.…”
Section: Pin-chip Bonding For Fully Vertical Interconnectsmentioning
confidence: 99%
“…2 (c)]. The channel (groove) is fabricated by means of single-point diamond turning (SPDT) [30], which provides extremely high nanometric accuracy and precision and allows to trench narrow channels in Cu and possibly other materials. The aspect ratio of our channels is at a minimum ∼ 140 µm/1 mm = 0.14, which is not terribly hard to achieve with SPDT.…”
Section: Pin-chip Bonding For Fully Vertical Interconnectsmentioning
confidence: 99%
“…These components, such as optical products, require high surface quality for optimal performance. However, achieving this high-quality standard often involves multiple processing steps, resulting in lengthy processing time and high costs [1]. Therefore, there is a need to research and develop more efficient processing tools and methods to reduce processing time and costs while maintaining the required high-quality standards.Traditional machining operations for the mould steel parts can be classified into two major categories: grinding and polishing.…”
mentioning
confidence: 99%