Fabrication of wafer-scale ordered micro/nanostructures for SERS substrates using rotational symmetry cantilever-based probe lithography

Wu, Lei; Ren, Yewei; Zhou, Haijun; Lin, Yu Chih; Liu, Renxing; Qian, Linmao; Yu, Bingjun

doi:10.1016/j.apsusc.2023.157220

Cited by 8 publications

(2 citation statements)

References 48 publications

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“…The laboratory's self-developed scratching machining equipment was used for the tests. The system consists of an X/Y-axis motion platform, a Z-axis motion platform, a laser sensor, and a high-precision cantilever [25], as shown in figure 5. The machining is controlled by a self-programmed software developed by C#.…”

Section: Results and Analysismentioning

confidence: 99%

Study on circular scanning for cross-scale micro/nanoscratching machining

Lin,

Tan,

Chen

et al. 2024

Eng. Res. Express

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Large-scale scanning probe can facilitate fabricating cross-scale micro/nano structures. However, the processing of complex two-dimensional patterns usually encounters challenges including numerous machining feature points and probe jumps, which results in low efficiency, as well as poor machining quality. Therefore, a circular scanning method based on corner point extraction (CSCE) was proposed in this study for programming the probe path and reducing the number of probe jumps. Before the machining, the target structures or images were converted into raw data points through image processing, and then the data was refined by corner point extraction for obtaining the machining points. Subsequently, the machining points were arranged in the order of a circular scanning algorithm to get the probe path. Using CSCE, the probe jump was only 1 time for processing an H-shaped pattern. By comparison with the circular scanning method based on intersection point extraction (CSIE) for the H pattern, the number of machining points in CSCE was reduced from 82 to 12, and the machining time was shortened from 17.15 s to 3.17 s. Consequently, CSCE can enable efficient and high-quality fabrication of cross-scale micro/nanostructures.

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Section: Results and Analysismentioning

confidence: 99%

Study on circular scanning for cross-scale micro/nanoscratching machining

Lin,

Tan,

Chen

et al. 2024

Eng. Res. Express

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“…Based on these advantages of convenient and highly efficient fabrication, template-free patterning has attracted wide attention for preparation of complicated microstructures [18][19][20]. Scanning probe lithography (SPL) has been validated for effectively template-free producing high-precision microstructures on silicon (Si) with mechanical removal or tip scratching-induced selective wet etching [21][22][23][24][25]. Notably, tip scratching can cause local electric conduction on Si surface, and the conductive ability depends on the scratching conditions [26].…”

Section: Introductionmentioning

confidence: 99%

Site-controlled preparation of metallic microstructures via mechanical scratch-induced selective electrodeposition

Zhu,

Gan,

Cui

et al. 2024

Surf. Topogr.: Metrol. Prop.

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Controlled preparation of metallic microstructures attracts wide interest in sensor and electronic fields. However, limited by fabrication technology, it faces challenges in achieving template-free and orientational formation of metallic microstructures. Herein, a site-controlled strategy via scratch-induced selective electrodeposition was proposed to prepare high-quality metallic structures on silicon (Si) surface with the assistance of scanning probe lithography (SPL). The effects of scratching and depositing conditions were systematically investigated for optimizing the preparation process. Selective electrodeposition mechanisms were addressed through topographic and conductive detections. It was found that single-cycle scratch created under higher loads was beneficial for preparing compact and continuous Cu structures. Further analysis indicated that higher normal loads in scratching can facilitate obtaining more conductive sites, promoting orientated migration of metal ions during the reaction, while the increase of reciprocating cycles can cause more amorphous layers and hinder electron transport. Moreover, post-annealing treatment can lead to the growth of Cu grain sizes, which contributes to the crystallinity. Notably, the proposed method is demonstrated with the preparation of Cu coils, which is sensitive to alternating magnetic field. These findings shed new light on the site-controlled preparation of high-quality metallic microstructures and the applications.

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