“…[2,3] However, it remains difficult to directly apply these methods to the microchip and electronics fabrication processes which are typically operated under vacuum with gas phase deposition methods (e. g., ALD, CVD, and PVD), since the solvents can corrode the overall fabrication equipment and contaminate the vacuum system. Furthermore, many MOFs (e. g., MOF-5, MOF-74, UiO-66, MIL-53, and MIL-101) [17,[26][27][28][29][30][31] need to use toxic polar solvents (e. g., DMF and DEF) [32] for the thin film growth following their powder-type synthesis recipe. These chemicals become toxic chemical wastes after being used, and are regulated under the TSCA (Toxic Substances Control Act) [33] in United States and REACH (Registration, Evaluation, Authorisation and Restriction of Chemicals) [34] in Europe because of their biological and environmental toxicity, running up extra expenses for their secure disposal.…”