2014
DOI: 10.1063/1.4900505
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Facile electron-beam lithography technique for irregular and fragile substrates

Abstract: A facile technique is presented which enables high-resolution electron beam lithography on irregularly-shaped, non-planar or fragile substrates such as the edges of a silicon chip, thin and narrow suspended beams and bridges, or small cylindrical wires. The method involves a spin-free dry-transfer of pre-formed uniform-thickness polymethyl methacrylate, followed by conventional electron beam writing, metal deposition, and lift-off. High-resolution patterning is demonstrated for challenging target substrates. T… Show more

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Cited by 7 publications
(4 citation statements)
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“…The general principle of the strategy presented here is in its core similar to a method presented by Chang et al [16] who fabricated 200 nm thick solid electron-sensitive PMMA dry film photoresist sheets by spin-coating. These PMMA films were directly transferred onto various non-planar substrate surfaces such as edges, silicon nitride bridges and deposited gold wires, followed by conventional electron beam lithography, metal deposition and resist lift-off.…”
Section: Introductionmentioning
confidence: 99%
“…The general principle of the strategy presented here is in its core similar to a method presented by Chang et al [16] who fabricated 200 nm thick solid electron-sensitive PMMA dry film photoresist sheets by spin-coating. These PMMA films were directly transferred onto various non-planar substrate surfaces such as edges, silicon nitride bridges and deposited gold wires, followed by conventional electron beam lithography, metal deposition and resist lift-off.…”
Section: Introductionmentioning
confidence: 99%
“…For instance, fabrication on the outer surface of 3D structures is possible by several means, including electron‐beam lithography, transfer method, and hydroprinting. [ 40–42 ] However, fabrication on the inner surface of the structure would be a great challenge, and to the best of our knowledge, no method has been reported to enable such fabrication. As shown in Figure 4d, the direct‐printing of nanofiber is demonstrated on the inside wall (concave surface) of a cylindrical tube (material: copper) (Movie S3, Supporting Information).…”
Section: Resultsmentioning
confidence: 99%
“…The approaches discussed thus far have all relied upon metasurfaces or DOEs on a flat plane commensurate with standard microfabrication technologies. Recent advances have enabled fabrication of optical and optoelectronic devices on curved surfaces, either via direct writing techniques 109 111 or conformal integration of flexible membranes 100 , 112 115 This new possibility has inspired alternative designs exploiting curved optical elements.…”
Section: Optical Metasurfaces: All Roads That Lead To Wfov Opticsmentioning
confidence: 99%
“…One integration route involves fabrication of metasurfaces on stretchable elastomer substrates followed by attachment onto curved surfaces 112 , 190 , 191 . Laser/electron-beam writing 109 111 and soft nanoimprint lithography 192 can be employed to directly pattern metasurface structures on curved surfaces. However, these techniques are often limited to integration on surfaces with relatively small curvature.…”
Section: Future Paths Through the Lens Of Meta-opticsmentioning
confidence: 99%