Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating

Hu, Guanqun; Huang, Rui; Wang, Hongli; Zhao, Qiuping; Zhang, Xingkai

doi:10.1007/s10008-022-05172-4

Cited by 8 publications

(2 citation statements)

References 33 publications

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“…Goranova et al discovered that as the Cu content of deposits decreased, so did the CCE (37). This phenomenon occurs because of the orderly deposition of Ni and Cu (38). In regular deposition, increasing the current density leads to an increased proportion of less noble metals in the deposited material (39).…”

Section: Surface Morphologymentioning

confidence: 99%

Effect of Current Density on Magnetic and Hardness Properties of Ni-Cu Alloy Coated on Al via Electrodeposition

Rosyidan,

Kurniawan,

Soegijono

et al. 2024

IJE

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Nickel (Ni)-rich single-phase nickel-copper (Ni-Cu) alloy coatings were produced on aluminum (Al) substrates by electrodeposition in stabilized citrate baths. Electrodeposition experiments were performed at four different current densities. Increasing the current density resulted in the metal deposition rate increasing faster than the hydrogen evolution rate; thus, the cathodic current efficiency increased. The crystal systems of the Ni-Cu alloys were face center cubic (fcc), with the (111) plane as the preferred crystal plane. Scanning electron microscopy with energy dispersive X-ray spectroscopy (SEM-EDS) measurements showed that the Ni content in the coating increased with increasing current density. The Ni-Cu 40 sample had the most Ni content and showed a homogeneous and compact morphology. It was found that the higher the concentration of Ni in the solution, the smaller the grain size. Measurements recorded with a vibrating sample magnetometer (VSM) showed that the Ni-Cu 40 sample provided magnetic saturation, with the highest value being 0.108 emu/g. The microhardness method produced 404 HV on the Ni-Cu 40 sample. In conclusion, higher current densities were associated with a higher Ni composition and increased thickness, which were responsible for the increases in the magnetic properties and hardness.

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Section: Surface Morphologymentioning

confidence: 99%

Effect of Current Density on Magnetic and Hardness Properties of Ni-Cu Alloy Coated on Al via Electrodeposition

Rosyidan,

Kurniawan,

Soegijono

et al. 2024

IJE

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“…The change in actual potential may reverse the direction of replacement deposition. For example, tin and nickel could be obtained on copper by galvanic replacement when using particular complexing agents [23,24] . In this work, we achieved the galvanic replacement deposition of cobalt on the copper based on the fact that a high concentration of iodine ions in the solution could signi cantly reduce the actual potential of copper [25] .…”

Section: Introductionmentioning

confidence: 99%

Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni-P plating

Hu,

Li,

Liao

et al. 2024

Preprint

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Electroless nickel-phosphorus (Ni-P) plating is a widely used surface treatment method due to its excellent corrosion and wear resistance properties. However, the inertness of copper to hypophosphite oxidation necessitates a palladium activation process for the preparation of Ni-P coating on copper. In this study, we present a convenient approach for the deposition of a cobalt layer on copper using galvanic replacement, facilitated by the special complexing ability of iodide. The results demonstrated that the actual potential of copper could be adjusted to be lower than that of cobalt in a solution containing 8 mol/L NaI, enabling the deposition of a cobalt layer on copper in 15 minutes at 90°C. Furthermore, the deposition rate of the cobalt layer was found to increase with the concentration of CoCl2 in the NaI solution. Importantly, the Ni-P coating obtained through cobalt layer activation exhibited morphology, structure, and corrosion resistance, friction resistance similar to the Ni-P coating obtained using the common palladium activation. Therefore, the cobalt layer prepared on copper through galvanic replacement may serve as a viable alternative to palladium for activating electroless Ni-P plating.

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Parameter optimization and performance study of Ni–P coatings prepared by pulse-assisted jet electrochemical deposition

Liu

Zheng

et al. 2022

J Solid State Electrochem

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Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating

Cited by 8 publications

References 33 publications

Effect of Current Density on Magnetic and Hardness Properties of Ni-Cu Alloy Coated on Al via Electrodeposition

Effect of Current Density on Magnetic and Hardness Properties of Ni-Cu Alloy Coated on Al via Electrodeposition

Cobalt layer prepared on copper using galvanic replacement as an alternative to palladium for activating electroless Ni-P plating

Parameter optimization and performance study of Ni–P coatings prepared by pulse-assisted jet electrochemical deposition

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