Facile strategy for intrinsic low-<i>κ</i> dielectric polymers: molecular design based on space charge conservation

Ren, Wei; Li, Haoning; Huang, Xiao; Xing, Xiujing; Yan, Guangming; Yang, Jie; Zhang, Gang

doi:10.1039/d3mh02034g

Mater. Horiz.

2024

DOI: 10.1039/d3mh02034g

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Facile strategy for intrinsic low-κ dielectric polymers: molecular design based on space charge conservation

Wei Ren,

Haoning Li,

Xiao Huang

et al.

Abstract: The growing need for high-power and compact-size microelectronic integrated circuits (ICs) in modern microelectronic industries and 5G communication systems demands low dielectric constant (κ) polymer dielectrics with excellent temperature capability,...

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Achieving an Ultralow-κ yet Strong and Transparent Film by Antisolvent-Confined Nanowelding of Electrospun Polyimide Nanofibers

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Developing ultralow-κ (dielectric constant) polyimides (PIs) that are mechanically robust while also being optically transparent is challenging. For the first time, we report a nanoporous PI film with an ultralow κ of 1.8 in combination with a tensile strength of up to 180 MPa, a Young's modulus of up to 6 GPa, and a transmittance of ∼88%. This is achieved by direct nanowelding of a porous electrospun PI nanofiber membrane using a simple mixture of ethanol-dominating DMAc. Benefiting from the effective evaporation of the antisolvent ethanol upon heating, the proposed nanowelding approach allows for the localized surface dissolution of the PI nanofibers, which enables the dissolved PI to "glue" the nanofibers and occupy vacant space in the membrane, resulting in the formation of a dense but nanoporous self-reinforced nanocomposite film. Our findings provide a renewed understanding of the potential of electrospun nanofibrous materials, and the underlying principle can hopefully be applied to other commodity polymers.

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Facile strategy for intrinsic low-κ dielectric polymers: molecular design based on space charge conservation

Abstract: The growing need for high-power and compact-size microelectronic integrated circuits (ICs) in modern microelectronic industries and 5G communication systems demands low dielectric constant (κ) polymer dielectrics with excellent temperature capability,...

Cited by 3 publications

References 54 publications

Electrospinning-impregnation: Producing hydrophobic polyimide composites with superior dielectric properties

Electrospinning-impregnation: Producing hydrophobic polyimide composites with superior dielectric properties

Stable energy storage performance of introduced PI-PESU dielectric composite serving at the high electric and thermal fields with the designed layer structure

Achieving an Ultralow-κ yet Strong and Transparent Film by Antisolvent-Confined Nanowelding of Electrospun Polyimide Nanofibers

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