Facile strategy for low dielectric constant polyimide/silsesquioxane composite films: structural design inspired from nature

Ma, Yingyi; He, Zian; Liao, Ziwei; Xie, Junwen; Yue, Hongyan; Gao, Xin

doi:10.1007/s10853-021-05771-y

Cited by 30 publications

(19 citation statements)

References 43 publications

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“…However, the glass transition temperatures of the films were lower than 290 °C and no mechanical properties were described. Ma et al [ 22 ] prepared porous low-dielectric polyimide films by using microemulsion method, in which water droplets acted as template. Polyhedral oligomeric polysiloxane (POSS) with hierarchical porous structure was coated on both sides of planar polyimide (PI) films to prepare sandwich composite films.…”

Section: Introductionmentioning

confidence: 99%

Dielectric Properties of Fluorinated Aromatic Polyimide Films with Rigid Polymer Backbones

Yang

Zheng

et al. 2022

Polymers

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Fluorinated aromatic polyimide (FAPI) films with rigid polymer backbones have been prepared by chemical imidization approach. The polyimide films exhibited excellent mechanical properties including elastic modulus of up to 8.4 GPa and tensile strength of up to 326.7 MPa, and outstanding thermal stability including glass transition temperature (Tg) of 346.3–351.6 °C and thermal decomposition temperature in air (Td5) of 544.1–612.3 °C, as well as high colorless transmittance of >81.2% at 500 nm. Moreover, the polyimide films showed stable dielectric constant and low dielectric loss at 10–60 GHz, attributed to the close packing of rigid polymer backbones that limited the deflection of the dipole in the electric field. Molecular dynamics simulation was also established to describe the relationship of molecular structure and dielectric loss.

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Section: Introductionmentioning

confidence: 99%

Dielectric Properties of Fluorinated Aromatic Polyimide Films with Rigid Polymer Backbones

Yang

Zheng

et al. 2022

Polymers

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“…This is because a certain content of TAPB promotes the formation of crosslink networks, which decrease the distance between the molecules and prevents water from entering the molecular chains. However, excessive addition of TAPB leads to incomplete amino reactions, so the hydrophobicity of the films was reduced [20]. Therefore, the fluorinated groups and crosslinked structure contribute to the enhancement of the hydrophobicity of PIs.…”

Section: Resultsmentioning

confidence: 99%

Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties

Zhao¹,

Cao²,

Huang³

et al. 2022

Express Polym. Lett.

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There is a great demand for low dielectric materials as insulating interlayers in large-scale integrated circuit development. However, it is still a huge challenge to reduce the dielectric permittivity of polymers while maintaining excellent thermal stability and mechanical properties. In this work, the fluorinated polyimides (PIs) in combination with a micro-branched crosslinking structure were prepared successfully by introducing different amounts of 1,3,5-tris(4-aminophenyl) benzene (TAPB) to obtain ultra-low dielectric permittivity. The results revealed that PI film containing 2 mmol TAPB had the lowest dielectric permittivity (2.47) and dielectric loss (0.008) at 1 MHz due to the fluorine atoms and the micro-branched crosslink structure, which not only decreased the molecular polarizability but also increased the free fractional volume. In addition, PI film containing 2 mmol TAPB had the highest tensile strength of 106.02 MPa with an elongation at a break of 15.1% because the presence of TAPB effectively promoted the connection between PI molecular chains, resulting in the inhibition of the molecular mobility. The incorporation of TAPB also enhanced the thermal stability and ultraviolet light-shielding performance of PI films. This method paves the way for the development of PIs with ultra-low dielectric permittivity for the electronic industry.

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“…Zhang obtained controllable porous materials by introducing hydroxy‐Boc‐assisted modification and thermal foaming 1 . There are many ways to form pore structure, such as pyrolysis foaming method, 1,27 chemical dissolution method, 28–30 microemulsion method, 31–34 immersion precipitation phase transformation method, 2 and so on 35–41 . Although the pore structure is introduced, the mechanical property of the film is greatly damaged.…”

Section: Introductionmentioning

confidence: 99%

Construction of porous poly (aryl sulfide sulfone) film with low dielectric constant and excellent mechanical property

Zhu

Wei

Wang

et al. 2022

J of Applied Polymer Sci

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The low dielectric constant and excellent mechanical property polymer film plays important roles in the high‐speed integrated circuits. In this work, porous poly (aryl sulfide sulfone) (PASS) films with different pore regularities and distributions were systematically fabricated via a combination process with solvent evaporation, wet induced phase separation, and hot pressing. It is found that the macroporous structure of PASS films changed from irregular shape with large pore size distribution to regular shape with small pore size distribution and the sponge‐like pore structure disappeared then formed a dense layer by controlling the time of solvent evaporation and hot pressing, to realize the effective control of the pore structure. The optimal PASS porous film D3 which was heated for 25 min and then hot pressed for 4 min has a low dielectric constant (2.44) and dielectric loss (0.010), high tensile strength (62.14 MPa) and breakdown strength (139.32 kV/mm), and low water absorption (0.54%). The comprehensive excellent properties are beneficial to the application of PASS films in microelectronic devices.

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Facile strategy for low dielectric constant polyimide/silsesquioxane composite films: structural design inspired from nature

Cited by 30 publications

References 43 publications

Dielectric Properties of Fluorinated Aromatic Polyimide Films with Rigid Polymer Backbones

Dielectric Properties of Fluorinated Aromatic Polyimide Films with Rigid Polymer Backbones

Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties

Construction of porous poly (aryl sulfide sulfone) film with low dielectric constant and excellent mechanical property

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