2013
DOI: 10.1111/jace.12209
|View full text |Cite
|
Sign up to set email alerts
|

Facile Synthesis of “Quench‐Free Glass” and Ceramic‐Glass Composite for LTCC Applications

Abstract: The 10 mol% ZnO-2 mol% B 2 O 3 -8 mol% P 2 O 5 -80 mol% TeO 2 (ZBPT) glass was prepared by quenching as well as slowly cooling the melt. The ZBPT glass prepared by both methods show similar microwave dielectric properties. ZBPT glass has an e r of 22.5 (at 7 GHz), Q u 3 f of 1500 GHz, and τ f of À100 ppm/°C. The ceramic-glass composites of Sr 2 ZnTeO 6 (SZT) and ZBPT is prepared through two convenient methods: (a) conventional way of co-firing the ceramic with ZBPT glass powder and (b) a nonconventional facile… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1

Citation Types

0
4
0

Year Published

2015
2015
2023
2023

Publication Types

Select...
5
2
1

Relationship

0
8

Authors

Journals

citations
Cited by 14 publications
(4 citation statements)
references
References 25 publications
0
4
0
Order By: Relevance
“…The properties of fired ceramics are mainly designed on a slurry preparation stage. It is worth of noticed that tapes with significantly different properties can be fabricated using tape casting technique [35][36][37][38][39]. …”
Section: Tape Castingmentioning
confidence: 99%
“…The properties of fired ceramics are mainly designed on a slurry preparation stage. It is worth of noticed that tapes with significantly different properties can be fabricated using tape casting technique [35][36][37][38][39]. …”
Section: Tape Castingmentioning
confidence: 99%
“…However, as an introduced impurity, the glass may increase the number of pores in the sintered body and affect the unique dielectric, thermal, and mechanical properties of ceramics. 8,9 Qualified LTCC materials should meet the requirements of a low dielectric constant (ε r ), low dielectric loss (tan δ), high thermal conductivity, low coefficient of thermal expansion (CTE), and structural densification. 10 LTCC is mainly used in the fields of electronic packaging and microwave communication devices.…”
Section: Introductionmentioning
confidence: 99%
“…Some newer applications, such as in low temperature co-fired ceramics (LTCCs) and dynamic random access memories (DRAMs), utilise the material's dielectric properties. LTCC applications require the sintering temperature to be below the melting point of the electrode materials [2]. The chemical processes of adding glass and using starting materials with ultra-fine particle sizes improve the characteristics of ceramics at low sintering temperatures [3].…”
Section: Introductionmentioning
confidence: 99%