Facile synthesis of soluble, self-crosslinkable and crystalline polyimides with ultrahigh thermal/chemical resistance

Tang, Jinyu; Li, Weizhong; Wang, Zhonggang

doi:10.1016/j.polymer.2023.125717

Cited by 9 publications

(5 citation statements)

References 45 publications

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“…The enhancement of chain–chain interactions between molecular chains caused by CN groups is not conducive to improving the solubility of polymers. By contrast, the larger dipole moment in the CN group leads to enhanced solvation of polar solvents 47 . In this study, CN groups became the dominant factor in improving polymer solubility by enhancing the solvation effect of polar solvents.…”

Section: Resultsmentioning

confidence: 79%

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Synthesis and properties of phenolphthalein‐based thermoplastic poly(ether nitrile imide)s via aromatic nucleophilic substitution polymerization

Ma,

Fang,

Chen

2024

Polymer Engineering & Sci

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Aromatic nucleophilic substitution polymerization was used to synthesize five poly(ether nitrile imide)s (PENIs) that include benzonitrile and bulky cardo groups from a mixture of phenolphthalein (PP), 4,4′‐bis(4‐fluorophthalimide) diphenyl ether (4,4′‐BFPI), and 2,6‐difluorobenzonitrile (DFBN). The structure and properties relationship of PENIs with different ratios of DFBN and 4,4′‐BFPI was explored. It was found that the glass transition temperature (Tg) of PENIs decreased from 280 to 260°C, while the temperature of 5% thermal weight loss (T5%) in N2 increased from 429 to 453°C as the benzonitrile content in PENI increased. The produced PENI films had good mechanical characteristics, including tensile strengths of 103–112 MPa, elongations at break of 5.6%–8.2%, and tensile moduli of 2.9–3.4 GPa. Furthermore, the solubility and melt processability were also improved with the introduction of the benzonitrile group. Compared with poly(ether ketone imide)s (PEKIs) and poly(ether sulfone imide)s (PESIs), PENIs with benzonitrile displayed higher Tg, tensile modules, and lower complex viscosity.

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Section: Resultsmentioning

confidence: 79%

“…By contrast, the larger dipole moment in the CN group leads to enhanced solvation of polar solvents. 47 In this study, CN groups became the dominant factor in improving polymer solubility by enhancing the solvation effect of polar solvents.…”

Section: Solubilitymentioning

confidence: 99%

Synthesis and properties of phenolphthalein‐based thermoplastic poly(ether nitrile imide)s via aromatic nucleophilic substitution polymerization

Ma,

Fang,

Chen

2024

Polymer Engineering & Sci

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“…In addition, the LTP/LTD realized by our device has a good linearity. Most importantly, compared with our previous work, due to the excellent heat resistance of PI, the active layer based on the PI matrix can withstand being baked multiple times at high temperature during fabrication of the devices. Therefore, the devices based on PI-MoS 2 QD nanocomposites can potentially be fabricated into highly integrated 3D stacked arrays.…”

Section: Results and Discussionmentioning

confidence: 92%

Three-Dimensional Integrated Synaptic Devices Based on a Silver-Cluster Conduction Mechanism with High Thermostability

Li,

et al. 2024

ACS Appl. Mater. Interfaces

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During the operation of synaptic devices based on traditional conductive filament (CF) models, the formation and dissolution of CFs are usually uncertain. Moreover, when the device is operated for a long time, the CFs may dissolve due to both the Joule heat generated by the device itself and the thermal coupling between the devices. These problems seriously reduce the reliability and stability of the synaptic device. Here, an artificial synapse device based on polyimide-molybdenum disulfide quantum dot (MoS 2 QD) nanocomposites is presented. Research has shown that MoS 2 QDs doped into the active layer can effectively induce the reduction of Ag ions into Ag atoms, leading to the formation of Ag clusters and thereby achieving control over the growth of the CFs. Therefore, the device is capable of stably realizing various basic synaptic functions. Moreover, the long-term potentiation/longterm depression (LTP/LTD) of this device shows good linearity. In addition, due to the change in the shape of the CFs, the highly integrated devices with a three-dimensional (3D) stacked structure can operate normally even in a high-temperature environment of 110 °C. Finally, the synaptic characteristics of the devices on learning and inference tests show that their recognition rates are approximately 90.75% (room temperature) and 90.63% (110 °C).

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“…It can be seen from Figure 4a that there is an exothermic peak on the heat flow density curve of the PI powder. The appearance of a peak at 230 °C indicates the occurrence of cross-linking reactions [24,25]. As seen from the heat flow density curve of the hot-pressed PI, the Tg of the hot-pressed PI material was 356.5 °C.…”

Section: Microstructural Characterization Thermal Stability and Mecha...mentioning

confidence: 98%

Surface Modification of Nano-Al2O3 with Silane Coupling Agent and Its Effect on the Compressive Strength of PI/Al2O3 Composites

Cao,

Wang,

Liu

et al. 2023

Coatings

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In this study, a series of nano-Al2O3 reinforced polyimide (PI) composites were fabricated using the hot compression method. A silane coupling agent was used to modify the surface of nano-Al2O3 powder to enhance the PI/Al2O3 interface compatibility. The effects of Al2O3 contents on the microstructures, thermal behavior and mechanical properties of PI/Al2O3 composites were investigated. The results suggested that chemical reactions occurred during in situ modification. The nano-Al2O3 was cross-linked to the PI matrix, which reduced the mobility of PI chains and improved the elastic modulus of the composites. When the Al2O3 content was 30 wt.%, the compressive strength of composites reached the maximum value of 313 MPa and increased by 26.5% than that of the PI matrix.

show abstract

Facile synthesis of soluble, self-crosslinkable and crystalline polyimides with ultrahigh thermal/chemical resistance

Cited by 9 publications

References 45 publications

Synthesis and properties of phenolphthalein‐based thermoplastic poly(ether nitrile imide)s via aromatic nucleophilic substitution polymerization

Synthesis and properties of phenolphthalein‐based thermoplastic poly(ether nitrile imide)s via aromatic nucleophilic substitution polymerization

Three-Dimensional Integrated Synaptic Devices Based on a Silver-Cluster Conduction Mechanism with High Thermostability

Surface Modification of Nano-Al2O3 with Silane Coupling Agent and Its Effect on the Compressive Strength of PI/Al2O3 Composites

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