Facile tailoring of thermal transition temperatures of epoxy shape memory polymers

Xie, Tao; Rousseau, Ingrid A.

doi:10.1016/j.polymer.2009.02.035

Cited by 479 publications

(360 citation statements)

References 19 publications

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“…The tan δ curves provide additional assurance that the T g undergoes only slight variation due to the addition of CB into the SMP. Comparing the non-doped SMP curves to those reported in Reference [19] shows essentially identical results. The final property of significant interest is whether the shape fixity and recovery of the non-doped SMP is maintained with added CB.…”

Section: Resultssupporting

confidence: 76%

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An Internally Heated Shape Memory Polymer Dry Adhesive

Eisenhaure

Kim

2014

Polymers

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A conductive epoxy-based shape memory polymer (SMP) is demonstrated using carbon black (CB) as a dopant for the purpose of creating an SMP dry adhesive system which can internally generate the heat required for activation. The electrical and mechanical properties of the CB/SMP blends for varying dopant concentrations are characterized. A composite adhesive is created to minimize surface contact resistance to conductive tape acting as electrodes, while maintaining bulk resistivity required for heat generation due to current flow. The final adhesive can function on flat or curved surfaces. As a demonstration, a 25 mm wide by 45 mm long dry adhesive strip is shown to heat evenly from an applied voltage, and can easily hold a mass in excess of 6 kg when bonded to a spherical concave glass surface using light pressure at 75 °C.

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Section: Resultssupporting

confidence: 76%

“…In this paper, we use a particular SMP formulation developed by Xie and Rousseau in Reference [19], referred to as "NGDE2" by the authors. This particular formulation has been used as part of several dry adhesive systems [7,13,14], and serves as the basis of the dry adhesive system demonstrated here.…”

Section: Methodsmentioning

confidence: 99%

An Internally Heated Shape Memory Polymer Dry Adhesive

Eisenhaure

Kim

2014

Polymers

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“…It must be taken into account that the mechanical response of crosslinked polymers is highly complex and departures from the ideal elastomeric behaviour can be expected [18,19]. As an example, Xie and Rousseau [20] showed that it was possible to increase the number of crosslinks by replacing DGEBA with a shorter and flexible diepoxide, but leading to an actual decrease of the Tg and of the relaxed modulus due to the enhanced mobility of the network structure. In the present case, it is verified that the constraining effect of the increased crosslinking density and the presence of rigid isocyanurate crosslinks dominate, at least in the formulations with a low amount of TGIC but, upon increasing the TGIC content, furthermore, the resulting effect could be a balance between different factors.…”

Section: Thermal Characterization Of the Materialsmentioning

confidence: 99%

Enhancement in the Glass Transition Temperature in Latent Thiol-Epoxy Click Cured Thermosets

et al. 2015

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Tri and tetrafunctional thiol were used as curing agent for diglycidyl ether of bisphenol A (DGEBA) catalyzed by a commercially available amine precursor, LC-80. Triglycidyl isocianurate (TGIC) was added in different proportions to the mixture to increase rigidity and glass transition temperature (Tg). The cooperative effect of increasing functionality of thiol and the presence of TGIC in the formulation leads to an increased Tg without affecting thermal stability. The kinetics of the curing of mixtures was studied by calorimetry under isothermal and non-isothermal conditions. The latent characteristics of the formulations containing amine precursors were investigated by rheometry and calorimetry. The increase in the functionality of the thiol produces a slight decrease in the storage lifetime of the mixture. The materials obtained with tetrathiol as curing agent showed the highest values of Young's modulus and Tg.

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“…As a consequence, thermosetting SMPs, especially epoxybased SMPs, have been highly attractive particularly in advanced applications [13,18,19]. To further broaden the useful property range of shape memory epoxy, epoxy-based shape memory copolymers and epoxy-based shape memory composites have also been developed [18][19][20][21]. Recently, Xie and Rousseau [20] had developed methods to tailor transition temperature (T g ) and shape recovery properties of SMPs based on aromatic epoxy as hard segments, aliphatic epoxy as soft segments and aliphatic amine as curing agents.…”

mentioning

confidence: 99%

Effects of benzoxazine resin on property enhancement of shape memory epoxy: A dual function of benzoxazine resin as a curing agent and a stable network segment

Tanpitaksit¹,

Jubsilp²,

Rimdusit³

2015

Express Polym. Lett.

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Abstract. An ability of bisphenol-A/aniline based benzoxazine resin (BA-a) to simultaneously acts as a curing agent and a stable or rigid network segment for shape memory epoxy, i.e. a two component system, is demonstrated. This significantly simplifies a formulation of present shape memory epoxy systems, i.e. a three or four component system. A suitable content of BA-a in the aliphatic epoxy (NGDE)/polybenzoxazine (PBA-a) samples for good shape memory performance is in a range of 30 to 50 mol%. The storage modulus of the obtained NGDE/PBA-a shape memory polymers (SMPs) was increased from 3.57 GPa for 30 mol% BA-a content to 4.50 GPa for 50 mol% BA-a content. Glass transition temperature of the sample was also substantially increased with increasing BA-a fraction, i.e. from 51°C to 140°C. Flexural modulus and strength at room temperature of the samples at 50 mol% BA-a were found to be as high as 3.97 GPa and 132 MPa compared to the maximum values of 2.54 GPa and 100 MPa of SMP based on cyanate ester-epoxy. All samples exhibited a high value of shape fixity close to 100%. A presence of the BA-a in the samples also imparted a greater recovery stress ranging from 0.25 to 1.59 MPa. Consequently, the obtained NGDE/PBA-a copolymers are highly attractive for shape memory materials to be used in a broader range of applications particularly at elevated temperature and a higher recovery stress value.

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Facile tailoring of thermal transition temperatures of epoxy shape memory polymers

Cited by 479 publications

References 19 publications

An Internally Heated Shape Memory Polymer Dry Adhesive

An Internally Heated Shape Memory Polymer Dry Adhesive

Enhancement in the Glass Transition Temperature in Latent Thiol-Epoxy Click Cured Thermosets

Effects of benzoxazine resin on property enhancement of shape memory epoxy: A dual function of benzoxazine resin as a curing agent and a stable network segment

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