Vacuum
 2022
DOI: 10.1016/j.vacuum.2021.110782
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Facilitating strong interfacial bonding of immiscible Nb/Cu system using consumable Ti interlayer

Mengen Liu
1
,
Li Bai
2
,
Yongqiang Deng
3
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Cited by 5 publications
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On formation of intermetallic compounds at the Copper /Niobium-Titanium interface

Karpati
1
,
Korozs
2
,
Kaptay
3
et al. 2022
Journal of Alloys and Compounds
3
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1
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On formation of intermetallic compounds at the Copper /Niobium-Titanium interface

Karpati
1
,
Korozs
2
,
Kaptay
3
et al. 2022
Journal of Alloys and Compounds
3
0
1
0
View full textAdd to dashboardCite

Migrating behaviors of interfacial elements and oxide layers during diffusion bonding of 6063Al alloys using Zn interlayer in air

Zhao1,
Xu2,
Leng3
et al. 2023
Journal of Materials Science & Technology
10
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The influence of Ti interlayer on the microstructure evolution and mechanical properties of CuW/Al composite

Wang
1
,
Chen
2
,
Shao
3
2023
Vacuum
1
0
0
0
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