The development of 5G technology has raised concerns about the heat buildup in microelectronic components, which can hinder device performance and integration. Inspired by the structure of loofah, we designed thermally conductive substrates using polydimethylsiloxane (PDMS) and graphene oxide (GO) incorporated into copper foam (F‐Cu). We also created nano‐thermal management composites with organic thermochromic material‐GO/PDMS/F‐Cu. The composites had a thermal conductivity of 1.02 Wm−1 K−1 with 15 wt% content of (35‐, 45‐, and 65‐) organic thermochromic materials (OTM), showing efficient heat dissipation. Practical testing showed significantly improved cooling effects compared to pure copper foam, with a CPU temperature drop of 9.6°C. Additionally, the surface color changes at specific temperature thresholds, offering an innovative way to determine the temperature range of electronic devices. This material also provides a solution for monitoring the temperature of densely integrated electronic devices.Highlights
Enables temperature visualization in microelectronics.
The nanocomposite achieves a value of 1.08 Wm−1 K−1.
Nanocomposites predict heat source temperature via thermochromic coating.
The cyclic test exhibits commendable stability and reliability.