Factors determining the efficiency of magnetron sputtering. Optimization criteria

Rogov, A. V.; Kapustin, Yu. V.; Martynenko, Yu. V.

doi:10.1134/s1063784215020206

Cited by 14 publications

(2 citation statements)

References 6 publications

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“…The using of premixes significantly affects the formation of structure and properties of the finished product. One of the most promising ways for obtaining highquality composite materials is to use the powders with a coating, applied by magnetron sputtering [10]. Advantages of the magnetron method are high performance; accuracy of deposited chemical composition; uniformity of coating; no thermal effect on processed material.…”

Section: Introductionmentioning

confidence: 99%

Surfacing of Ti-Al System Mechanocomposites by Magnetron Deposition

Ситников

Yakovlev

Popova

2021

DDF

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The investigations of (Ti + Al)-SiO2 surfacing by magnetron deposition are presented in this article. The correlation between film`s thickness deposited on the particles by mechanocomposites and magnetron sputtering time was established. It was determined that the rational time for surfacing by Ti-Al mechanocomposites system is about 40 minutes. According that deposition time the thickness of deposited SiO2 films were obtained as 5.2 microns.

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Section: Introductionmentioning

confidence: 99%

Surfacing of Ti-Al System Mechanocomposites by Magnetron Deposition

Ситников

Yakovlev

Popova

2021

DDF

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“…The E

\times

B drift increases the electrons’ lifetime in the cathode dark space, enhancing the efficiency of the plasma ionization processes . Hence, similar to conventional magnetron sputtering, using stronger magnets increases electron confinement and is supposed to provide a higher number of sputtered atoms for NP growth . In addition, the intensity of the magnetic field (MF) also has a strong effect on the local density of free atoms emitted from the sputtered target in the aggregation region.…”

Section: Introductionmentioning

confidence: 99%

Effect of magnetic field on the formation of Cu nanoparticles during magnetron sputtering in the gas aggregation cluster source

Vaidulych

Hanuš

Kousal

et al. 2019

Plasma Processes & Polymers

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Reliable production of nanoparticles (NPs) by magnetron sputtering in a gas aggregation source (GAS) is of great interest because of many potential applications. The size, shape, or structure of NPs can be tuned by the operational parameters of the GAS. In this study, fabrication of copper (Cu) NPs is investigated dependent on the magnetron magnetic field (MF)-a not much studied parameter. Decrease of the MF from 83 to 35 mT results in changes in the shape and size distribution of the NPs. MF also strongly affects the NPs deposition rate (DR). Electromagnetic trapping of the NPs in the vicinity of the magnetron target is proposed to be responsible for the changes in DR and polydispersity. The highest DR was reached at 45 mT. K E Y W O R D Scopper nanoparticles, gas aggregation source (GAS), magnetic field, magnetron sputtering

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