Factors Identification on Optimization of Ball Placement Tool for Flip-Chip-Ball-Grid-Array Product

Abstract

Market demand on system-on-chip (SoC) using ball-attach technologies, it is time for ball-attach module to have an improvement on their capabilities within limited resources (man and machine). This paper identifies caused of factor which contributes more time to production time. Justification on improving ball-attach module cycle time during high volume activities is explained.