Failure analysis on the premature delamination in the power module of the inverter for new energy vehicles

Chen, Jie; Yang, Zhen-Guo

doi:10.1016/j.engfailanal.2022.106915

Cited by 5 publications

(1 citation statement)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Additionally, a survey based on over 200 products from 80 businesses found that 31% of respondents selected semiconductor-powered devices as the most fragile parts of power converters used for various power applications [11]. Furthermore, many research-ers have emphasized numerous IGBT-module-related research areas and proposed vari-ous techniques and analysis methods for the acceleration testing of these modules to es-timate failure modes in the early stages of the implementation process, such as the analy-sis of IGBT module fault causes presented in [12,13]; the various techniques of accelera-tion testing for fault diagnostic methodologies given in [14][15][16]; the analysis of parameters affecting failure modes in [17]; and the different measuring equipment used in the experimental environment for module fault diagnosis, such as a scanning electron microscope (SEM), X-ray, and an IR camera, as proposed in [18][19][20].…”

Section: Introductionmentioning

confidence: 99%

Estimation Technique for IGBT Module Junction Temperature in a High-Power Density Inverter

Okilly,

Choi,

Kwak

et al. 2023

Machines

View full text Add to dashboard Cite

During the last few decades, insulated-gate bipolar transistor (IGBT) power modules have evolved as reliable and useful electronic parts due to the increasing relevance of power inverters in power infrastructure, reliability enhancement, and long-life operation. Excessive temperature stresses caused by excessive power losses frequently cause high-power-density IGBT modules to fail. As a result, module temperature monitoring techniques are critical in designing and selecting IGBT modules for high-power-density applications to guarantee that temperature stresses in the various module components remain within the rated values. In this paper, a module’s different losses were estimated, a heating pipe system for the thermal power cycling technique was proposed, and finite element method (FEM) thermal modeling and module temperature measurement were performed using ANSYS Icepak software version 2022 R1 to determine whether the IGBT module’s temperature rise was within acceptable bounds. To test the proposed technique, a proposed design structure of the practical railway application with a 3.3 MW traction inverter is introduced using commercialized IGBT modules from Semikron company with maximum temperature of about 150 °C. the FEM analysis results showed that the maximum junction temperature is about 109 °C which is in acceptable ranges, confirming the appropriate selection of the employed IGBT module for the target application.

show abstract