2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2018
DOI: 10.1109/ipfa.2018.8452534
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Failure Analysis Techniques for 3D Packages

Frank Altmann
1
,
Sebastian Brand
2
,
Matthias Petzold
3
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Cited by 5 publications
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References 13 publications
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A Hybrid Modelling Approach for Parameter Estimation of Analytical Reflection Models in the Failure Analysis Process of Semiconductors

Kamm
1
,
Sharma
2
,
Jazdi
3
et al. 2021
2021 IEEE 17th International Conference on Automation Science and Engineering (CASE)
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A Hybrid Modelling Approach for Parameter Estimation of Analytical Reflection Models in the Failure Analysis Process of Semiconductors

Kamm
1
,
Sharma
2
,
Jazdi
3
et al. 2021
2021 IEEE 17th International Conference on Automation Science and Engineering (CASE)
2
0
0
0
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Sample Preparation for Deprocessing of 3D Multi-Die Stacked Package

Kör
1
,
Liu
2
,
Gan
3
2020
2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)
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Mechanical Sample Preparation for Heterogeneous Integration(HI) Packaging

Xi,
Khan,
Varshney
et al. 2024
2024 IEEE Physical Assurance and Inspection of Electronics (PAINE)
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