Failure assessment software for circuit card assemblies

Osterman, Michael; Stadterman, Thomas

doi:10.1109/rams.1999.744130

Cited by 17 publications

(7 citation statements)

References 3 publications

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“…To determine whether these constants can be used up to 185 • C, the error between model estimate and experimental cycles to failure was calculated. To predict the lifetimes of solder joints under the environmental and operational loads, the test vehicle was modeled using simulation software [33]. The thermal fatigue model for solder interconnects in BGA packages used by the software was based on the Engelmaier model [34] and enhanced with internal calibration [25] for the packages.…”

Section: Solder Joint Life Simulationmentioning

confidence: 99%

Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications

George

Das

Osterman

et al. 2011

IEEE Trans. Device Mater. Relib.

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Applications with temperatures higher than the melting point of eutectic tin-lead solder (183 • C) require highmelting-point solders. However, they are expensive and not widely available. With the adoption of lead-free legislation, first in Europe and then in many other countries, the electronics industry has transitioned from eutectic tin-lead to lead-free solders that have higher melting points. This higher melting point presents an opportunity for the manufacturers of high-temperature electronics to shift to mainstream lead-free solders. In this paper, ball grid arrays (BGAs), quad flat packages, and surface mount resistors assembled with SAC305 (96.5%Sn+3.0%Ag+0.5Cu) and Sn3.5Ag (96.5%Sn+3.5%Ag) solder pastes were subjected to thermal cycling from −40 • C to 185 • C. Commercially available electroless nickel immersion gold board finish was compared to custom Sn-based board finish designed for high temperatures. The data analysis showed that the type of solder paste and board finish used did not have an impact on the reliability of BGA solder joints. The failure analysis revealed the failure site to be on the package side of the solder joint. The evolution of intermetallic compounds after thermal cycling was analyzed.Index Terms-Ball grid array (BGA) packages, electroless nickel immersion gold (ENIG), electronics reliability, high temperature, solder, thermal cycling.

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Section: Solder Joint Life Simulationmentioning

confidence: 99%

Thermal Cycling Reliability of Lead-Free Solders (SAC305 and Sn3.5Ag) for High-Temperature Applications

George

Das

Osterman

et al. 2011

IEEE Trans. Device Mater. Relib.

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“…For example, George et al [44] used virtual qualification and testing based on PoF principles to identify the top reliability concerns in communications hardware. calcePWA software [45], which provides the ability to model printed wiring assemblies (PWAs), conducts thermal and dynamic analyses on the modeled PWAs, and estimates life expectancy based on PoF models and user-defined life cycle loading conditions, is an example of a CAE software for conducting virtual qualification. calcePWA software [45], which provides the ability to model printed wiring assemblies (PWAs), conducts thermal and dynamic analyses on the modeled PWAs, and estimates life expectancy based on PoF models and user-defined life cycle loading conditions, is an example of a CAE software for conducting virtual qualification.…”

Section: Applications Of Pof To Ensure Reliabilitymentioning

confidence: 99%

“…Virtual qualification takes advantage of computer-aided engineering (CAE) software to estimate TTF, thus permitting components and systems to be qualified based on an analysis of the relevant failure mechanisms and associated failure modes. [44][45][46][47][48][49][50], a database of already validated PoF models is available to identify potential design weaknesses. In the calcePWA software used in Refs.…”

Section: Applications Of Pof To Ensure Reliabilitymentioning

confidence: 99%

Physics-of-failure (PoF) methodology for electronic reliability

Hendricks

George

Osterman

et al. 2015

Reliability Characterisation of Electrical and Electronic Systems

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“…Virtual qualifi cation involves using computer-assisted modeling and simulation based on PoF If fi eld data is collected in the same or a similar environment which accounts for all the life-cycle conditions. mechanics, and therefore, it is also referred to as the physics-of-failure-based approach [22]. 3 As input to physics-based models for the failure mechanisms.…”

Section: Qualifi Cation Process Overviewmentioning

confidence: 99%