Failure modes and bonding strength of ultrasonically-soldered glass joints

Brown, Jennifer Shaffer; Wilson, Caleb; Bohlen, Charles; Choi, Hongseok; Thompson, Lonny L.; Bostwick, Joshua

doi:10.1016/j.jmatprotec.2021.117385

Cited by 4 publications

(3 citation statements)

References 36 publications

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“…The bonding nature of the universal solders is induced by the high oxygen affinity of active elements, like Ti, Zn, and RE. During the bonding process, oxygen atoms in the ceramics or glass form bonds with these active elements at the oxidized interface (e.g., SiO 2 in this study) through diffusion effects [ 11 – 13 , 17 , 18 ]. Sufficient reflow time is beneficial to allow active elements to diffuse to the interface for optimal bonding.…”

Section: Resultsmentioning

confidence: 99%

“…8 . The failure types can be classified as a combination of ‘interfacial’ and ‘bulk region’ failures [ 18 ]. Further examination of the microstructure of the fractured solder joints through SEM imaging revealed that all three types of conditions (as-bonded, after aging, after cycling) exhibited both bulk and interfacial failure modes (Fig.…”

Section: Resultsmentioning

confidence: 99%

“…Typically, bonding SB solders to metal surfaces yields high shear strength on the order of 30–50 MPa [ 16 ]. However, when bonding is attempted without metallization on oxide or ceramic substrates and using active elements such as RE or Ti, soldering processes often result in moderate bonding strength, typically around 1 MPa [ 5 ], unless an ultrasonic-assisted soldering process is employed, which can increase the bonding strength to 2–11 MPa [ 17 , 18 ]. However, as far as we know, no attempt has been made to achieve higher bonding strength with RE- or Ti- containing SB solders.…”

Section: Introductionmentioning

confidence: 99%

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Ceramic-to-metal bonding using rare-earth containing Sn–Bi solder

Feng,

Pati,

Chung

et al. 2024

J Mater Sci: Mater Electron

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With the increasing miniaturization and power of optoelectronic devices, direct bonding of optical substrates like semiconductors and ceramics to metal heat sinks using low melting-point solder has gained significant interest. In this study, we demonstrated the bonding of glass to copper using Sn-58 wt% Bi solder (SB solder) doped with a small amount of rare earth (RE) elements. The RE elements act as active agents that facilitate the bonding to glasses without glass metallization. By optimizing the bonding parameters, such as reflow temperature and time, and employing an inert gas atmosphere to prevent solder or RE oxidation, we successfully achieved the highest shear strength in glass-copper solder joints using SB-RE solder, without the need for ultrasonic-assisted soldering (UAS). These results demonstrate the potential of using RE-containing solder for bonding unmetallized glass and ceramics in optoelectronic devices with metals at low soldering temperatures (< 200 °C). Furthermore, analysis of the shear strength and failure morphology of solder joints revealed only small degradation, primarily originating from the bulk solder region rather than the solder-glass interface, after both thermal aging (100 h) and cycling tests (100 cycles). The establishment of low-melting point RE-containing solders opens the possibility of direct jointing ceramic optoelectronic substrates to metal heat sinks for more efficient heat dissipation. In the meantime, our work also suggests that further optimization studies are necessary to explore its performance under more extreme working conditions.

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Section: Resultsmentioning

confidence: 99%

Section: Resultsmentioning

confidence: 99%