2014
DOI: 10.1002/asmb.2100
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Failure probability estimation with differently sized reference products for semiconductor burn‐in studies

Abstract: A burn-in study is applied to demonstrate compliance with a targeted early life failure probability of semiconductor products. This is achieved by investigating a sample of the produced chips for reliability-relevant failures. Usually, a burn-in study is carried out for a specific reference product with the aim to scale the reference product's failure probability to follower products with different chip sizes. It also appears, however, that there are multiple, differently sized reference products for which bur… Show more

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Cited by 5 publications
(2 citation statements)
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“…These products are called follower products. The early life failure probability of the follower products scales with the die size (see, e.g., Kurz et al 22,23 ). We call this effect area scaling.…”
Section: Bi Time Reduction For Follower Productsmentioning
confidence: 99%
“…These products are called follower products. The early life failure probability of the follower products scales with the die size (see, e.g., Kurz et al 22,23 ). We call this effect area scaling.…”
Section: Bi Time Reduction For Follower Productsmentioning
confidence: 99%
“…Some of these models can find a joint probability distribution over a few parameters, but none are able to effectively take all the potential contributors into consideration. In this sense, artificial intelligence (AI) has been applied to conduct reliability analysis in such nonlinear and complex systems . Shi et al used an artificial neural network (ANN) model to predict the crack growth rate in Type 304 stainless steel.…”
Section: Introductionmentioning
confidence: 99%