Failure study of solder joints subjected to random vibration loading at different temperatures

Zhang, Hongwu; Liu, Yang; Wang, Jian; Sun, Fenglian

doi:10.1007/s10854-015-2693-0

Cited by 24 publications

(6 citation statements)

References 24 publications

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“…For this purpose, some approaches and submodels along with the experimental procedures have been proposed to assess the lifetime of the electronic packages under both thermal cycling and vibration loading. [3][4][5][6][7] The primary results indicated that solder joints are the most susceptible parts of the electronic assembly under either thermal or mechanical loadings. [8][9][10] For instance, Zhang et al 11 showed that the maximum inelastic energy is accumulated on the solder balls in the bottom of fine-pitch ball grid array structure.…”

Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part L:

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In this work, the combination of vibration loading and thermal cycle effects on the fatigue properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) discrete was investigated. The fatigue mechanism under each loading mode was individually analyzed, and then according to the incremental damage superposition approach, the simultaneous effects were thoroughly studied. Under thermal cycling, the creep behavior of the solder is linked to the fatigue life. In fact, the creep accumulated strain in each thermal cycle has a straight relation to the failure time of solder joint. The origin of stress/strain in the assembly is owing to the sharp difference between coefficients of thermal expansions of the components in the electronic package. Regarding the vibration loading, the root mean square of peeling stress as a widely acceptable failure indicator was used to evaluate the vibration effects on the fatigue life. It is determined that the maximum stress is concentrated at the corner of solder layer. This result was similar to the outcomes of thermal cycling. The results also indicated that the combination of thermal and mechanical loadings accelerates the failure of the solder joint of the power MOSFET. Furthermore, the experimental and simulation studies showed similar results and approved the crack initiation at the corner of solder layer.

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Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part L:

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“…The 400 µm solder balls were obtained through cutting, remelting, and selection processes. The printed circuit board was a custom-made FR-4 substrate with copper pads of 310 µm in diameter and 70 µm in thickness [27]. The surface of the printed circuit board was treated with an organic solder protectant.…”

Section: Methodsmentioning

confidence: 99%

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

Kong,

Zhai,

et al. 2024

Crystals

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Sn58Bi solder is considered a promising lead-free solder that meets the performance requirements, with the advantages of good wettability and low cost. However, the low melting point characteristic of Sn58Bi poses a serious threat to the high-temperature reliability of electronic products. In this study, Sn58Bi solder alloy based on nickel (Ni) functionalization was successfully synthesized, and the effect of a small amount of Ni on creep properties and hardness of Cu/Sn58Bi/Cu micro solder joints at different temperatures (25 °C, 50 °C, 75 °C, 100 °C) was investigated using a nanoindentation method. The results indicate that the nanoindentation depth of micro solder joints exhibits a non-monotonic trend with increasing Ni content at different temperatures, and the slope of the indentation stage curve decreases at 100 °C, showing that the micro solder joints undergo high levels of softening. According to the observation of indentation morphology, Ni doping can reduce the indentation area and accumulation around the indentation, especially at 75 °C and 100 °C. In addition, due to the severe creep phenomenon at 100 °C, the indentation hardness rapidly decreases. The indentation hardness values of micro solder joints of Cu/Sn58Bi/Cu, Cu/Sn58Bi-0.1Ni/Cu, and Cu/Sn58Bi-0.2Ni/Cu at 100 °C are 14.67 ± 2.00 MPa, 21.05 ± 2.00 MPa, and 20.13 ± 2.10 MPa, respectively. Nevertheless, under the same temperature test conditions, the addition of Ni elements can improve the high-temperature creep resistance and hardness of Cu/Sn58Bi/Cu micro solder joints.

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“…Solder joints serve under this load environment, the initial failure starts from multi-solder joint fracture, and when the temperature rises from 25°C to 120°C, the failure mode gradually degenerates to single-solder joint fracture failure, and brittle fracture becomes ductile fracture. This is because the increase in temperature reduces the yield strength of the material and improves the plastic deformation ability of the solder joint itself, which promotes the deformation of the solder joint through the bulk solder and relieves the interfacial stress of the solder joint, resulting in the fracture of the solder joint requiring more energy consumption [20] . To validate the clustering results of the K-Means model, the characteristic data of failed solder joints under 20 G and 30 G accelerations at 65°C were collected using a sensor.…”

Section: Model Validation and Analysismentioning

confidence: 99%

Data-driven Digital Twin for Board-Level Packaging Interconnects under Multi-physics Loading

Luo

Liu

et al. 2023

Preprint

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Solder joints of electronic packaging devices are used as mechanical fixation and electrical interconnection between chips and circuit boards, which provides protection for the normal operation of electronic equipment. Therefore, real-time monitoring of the status of solder joints is essential for predictive maintenance of equipment. In this paper, we propose a digital twin based on semi-supervised learning for diagnosing faults in chip interconnection solder joints. In order to achieve maximum generalization of limited label information, the interdependence between sample labels with similar feature distributions is fully exploited by semi-supervised learning. Additionally, we use real-time monitoring data to update the learning model, and reveal the evolution of solder joint failure under different loads through diagnostic results of model. A dynamic model is formed by stimulated fault evolution characteristics into a solder joint failure model to form a diagnose fault dynamic model in a virtual space. Finally, we designed a thermal-vibration coupling experiment to verify the effectiveness of the digital twin-based solder joint failure diagnosis model. The results show that the digital twin maintains good consistency with the performance degradation process of the solder joint throughout its life cycle. Moreover, the diagnostic accuracy of the digital twin model can reach 85%, which proves that our method can monitor the service status of physical entities online, and intelligently predict the failure mode and life cycles under load conditions.

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Failure study of solder joints subjected to random vibration loading at different temperatures

Cited by 24 publications

References 24 publications

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

Data-driven Digital Twin for Board-Level Packaging Interconnects under Multi-physics Loading

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