Fast and Precise Temperature Control for a Semiconductor Vertical Furnace via Heater-Cooler Integration

Abstract

Semiconductor vertical furnaces must achieve even faster and more precise temperature control due to the demand for ever-reducing the minimum feature size or critical dimension in semiconductor chips. Also, the insulation performance of vertical furnaces has improved to reduce power consumption; as a side effect, temperature reduction operation takes longer without active cooling. Therefore, in addition to heaters, vertical furnaces equipped with coolers have emerged to achieve higher productivity, more precise temperature control, and lower power consumption. However, the inability to generate positive and negative control inputs for one of the heaters or coolers poses a challenge for an intuitive controller parameter design. The aim of this paper is to address these issues by proposing an intuitive method for designing a controller in the frequency domain which virtually integrates heaters and coolers. We implemented the controller in a full-scale actual semiconductor vertical furnace and first confirmed that the linearity is high. Furthermore, we experimentally verified that the controller achieves both high-speed, high-precision temperature control and low power consumption.

In-depth discussion on pitch doubling flow CpK improvement through process integration

“…However, a more even temperature distribution for vertical furnaces is required for the development on chip size progressively shrinkage. Further study on temperature controller design through heater-cooler Integration [15] is carried out to achieve a faster and more precise temperature control. As previously explained, ALD film thickness nonuniformity would directly translate to line CD variation post spacer strip.…”