1997
DOI: 10.1143/jjap.36.7655
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Fast Atom Beam Etching of Glass Materials with Contact and Non-Contact Masks

Abstract: Fast atom beam (FAB) etching of multicomponent glass and silica glass was performed using a contact mask (electron beam resist) and two non-contact masks (typically 5-µ m-diameter particles and a copper mesh with a 5 µ m line width and 20 µ m line spacing). FAB etching of a multi component glass substrate with the micro-particle mask successfully fabricated a precisely projected, 1.0-µ m-high outline pattern on the substrate. FAB etching of a silica glass substrate with the copper-mesh mask, which … Show more

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Cited by 32 publications
(10 citation statements)
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“…The middle plate was attached to the bottom plate by using an optical contact; that is, the plates were polished to an optical smoothness and then laminated together without any adhesive in an oven at 1150 °C. A shallow channel of the dam region was fabricated by the fast atom beam fabrication method on the upper side of the laminated plates as reported previously …”
Section: Methodsmentioning
confidence: 99%
“…The middle plate was attached to the bottom plate by using an optical contact; that is, the plates were polished to an optical smoothness and then laminated together without any adhesive in an oven at 1150 °C. A shallow channel of the dam region was fabricated by the fast atom beam fabrication method on the upper side of the laminated plates as reported previously …”
Section: Methodsmentioning
confidence: 99%
“…The middle plate was attached to the bottom plate by using an optical contact, that is, the plates were polished to an optical smoothness, and then laminated together without any adhesive in an oven at 1150 °C. A shallow channel in the dam region was fabricated by the fast atom beam method on the upper side of the laminated plates as reported previously. , The depth of the shallow channel was estimated as 10 μm, and the reaction solid phase, that is, polystyrene beads (41.7 μm in diameter) would be retained in the dam region. Finally, the cover plate was laminated onto the plates as described above.…”
Section: Methodsmentioning
confidence: 99%
“…A shallow channel in the weir region was fabricated by the fast atom beam method on the upper side of the laminated plates as reported previously [8,18]. The depth of the shallow channel was estimated as 10 mm, and the reaction solid phase, i.e., polystyrene beads (45 mm in diameter) would be retained in the weir region.…”
Section: Microchip Fabricationmentioning
confidence: 99%