Expanding thermal plasma chemical-vapor deposition has been used to deposit microcrystalline silicon films. We studied the behavior of the refractive index, crystalline fraction, and growth rate as a function of the silane (SiH4) flow close to the transition from amorphous to microcrystalline silicon. It was found that the refractive index, a measure for film density, increases when the average sticking probability of the depositing radicals decreases. Furthermore, we studied the influence of the position at which SiH4 is injected in the expanding plasma on the film density. It was found that the film density becomes higher when the SiH4 is injected closer to the substrate. Both findings strongly suggest that the film density benefits from a high contribution of the SiH3 radical to the growth of microcrystalline silicon.