2002
DOI: 10.1016/s0022-3093(01)01184-x
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Fast deposition of microcrystalline silicon with an expanding thermal plasma

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Cited by 22 publications
(9 citation statements)
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“…This explanation is consistent with the refractive indices of Fig. 5(b), which are lower than that of both c-Si and a-Si:H. The refractive index might be reduced due to the possible voids in the structure [23,26]. Besides, existence of the voids and correlation of C O with n imply that oxygen diffuses into the films after breaking the vacuum.…”
Section: Physical Properties and Their Correlationssupporting
confidence: 81%
“…This explanation is consistent with the refractive indices of Fig. 5(b), which are lower than that of both c-Si and a-Si:H. The refractive index might be reduced due to the possible voids in the structure [23,26]. Besides, existence of the voids and correlation of C O with n imply that oxygen diffuses into the films after breaking the vacuum.…”
Section: Physical Properties and Their Correlationssupporting
confidence: 81%
“…In this paper, c-Si: H films have been prepared using expanding thermal plasma (ETP) CVD. 18 ETP CVD is a remote plasma deposition technique, in which the plasma generation takes place in a relatively high pressure chamber (the cascaded arc plasma source), separate from the plasma chemistry that takes place when the precursor is injected in the low-pressure process chamber. This simplifies the chemistry to such an extent that ETP CVD is a suitable plasma deposition technique for the investigation of the influence of the plasma chemistry on the film deposition.…”
Section: Introductionmentioning
confidence: 99%
“…As a consequence of the high atomic hydrogen density in the reaction chamber, the depletion of SiH 4 is very high and can even reach 100%. 18 Furthermore, subsequent hydrogen abstraction reactions will take place, creating SiH x with x Ͻ 3. This is clearly illustrated by the CRDS measurements by Hamers et al, in which the SiH 4 flow is varied for a constant Ar and H 2 flow.…”
mentioning
confidence: 99%
“…Previous work, however, has shown that the μc-Si:H material quality is poor [12][13][14][15]. In general, device-grade microcrystalline (and amorphous) silicon material is found close to the so-called amorphous-tomicrocrystalline transition regime, i.e.…”
Section: Introductionmentioning
confidence: 94%