2021
DOI: 10.1080/00218464.2021.1880903
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Fast inductive curing of adhesively bonded glass-timber joints

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Cited by 3 publications
(2 citation statements)
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“…27 A reduction in curing temperature can reduce the energy consumption and cost of manufacturing adhesively bonded structural parts, 28,29 especially when the structural parts are large. 30 Seraji et al 31 utilized 2-ethyl-4-methylimidazole (2E4MI) and boron trifluoride ethylamine (BF 3 ) to accelerate the curing of flame-retardant-modified epoxy amine resin systems. They found that both 2E4MI and BF 3 accelerated the onset of curing and that increasing the flame retardant content in the modified epoxy resin reduced the glass transition temperature.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…27 A reduction in curing temperature can reduce the energy consumption and cost of manufacturing adhesively bonded structural parts, 28,29 especially when the structural parts are large. 30 Seraji et al 31 utilized 2-ethyl-4-methylimidazole (2E4MI) and boron trifluoride ethylamine (BF 3 ) to accelerate the curing of flame-retardant-modified epoxy amine resin systems. They found that both 2E4MI and BF 3 accelerated the onset of curing and that increasing the flame retardant content in the modified epoxy resin reduced the glass transition temperature.…”
Section: Introductionmentioning
confidence: 99%
“…Therefore, it is very important to reduce the curing temperature of epoxy/aromatic amine adhesive systems and improve the toughness of the epoxy structural adhesives without reducing the heat‐resistance 27 . A reduction in curing temperature can reduce the energy consumption and cost of manufacturing adhesively bonded structural parts, 28,29 especially when the structural parts are large 30 …”
Section: Introductionmentioning
confidence: 99%