Fast joining SiC ceramics with Ti3SiC2 tape film by electric field-assisted sintering technology

Zhou, Xiaobing; Han, Yu; Shen, Xizhong; Du, Shiyu; Lee, Jaehyung; Huang, Qing

doi:10.1016/j.jnucmat.2015.08.004

Cited by 67 publications

(41 citation statements)

References 38 publications

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“…The Ti 3 SiC 2 powders were used to prepare the tape film (thickness, 60 μm), and then employed as a joining layer. The joining process of SiC with Ti 3 SiC 2 tape film by SPS was similar with our published work . For a convenient comparing, all the SiC/Ti 3 SiC 2 /SiC joining couples were joined at 1300°C with the same heating and cooling rate of 400°C/min.…”

Section: Experimental and Computational Proceduresmentioning

confidence: 83%

“…To prevent localized heating of the measured area, a low laser power of 12 mw was used. The flexure strengths of the virgin SiC/Ti 3 SiC 2 /SiC joining couples and after postannealing at various temperatures were tested by a four‐point bend method using a laboratory made assembly, as reported elsewhere . At least five pieces of each sample were measured, and their average and maximum deviations were calculated.…”

Section: Experimental and Computational Proceduresmentioning

confidence: 99%

“…It combines the merits of metals and ceramics, such as high modulus, high fracture toughness, excellent thermal shock resistance, high electrical and thermal conductivities, and good oxidation, corrosion and irradiation resistance . In our previous work, SiC was joined successfully with Ti 3 SiC 2 tape film at a low temperature of 1300°C using SPS . Moreover, Katoh et al joined CVD SiC with a Ti 3 SiC 2 joining layer, and the shear strength and microstructures of the joined couples exhibited minor or insignificant influence of neutron irradiation at 800°C up to ~5 dpa.…”

Section: Introductionmentioning

confidence: 99%

“…Spark plasma sintering (SPS) technology is an efficient technique to fabricate ultra‐high temperature ceramics at low temperatures compared to conventional sintering methods. Recently, SPS has been widely used to join monolithic SiC and ceramic matrix composites due to the electric filed can accelerate solid state diffusion in the joining layer . Grasso et al firstly joined β‐SiC by SPS with Ti foil at 1700°C.…”

Section: Introductionmentioning

confidence: 99%

“…It is beneficial to Ti 3 SiC 2 fill into the defects of SiC surface during the joining process at high temperatures. Therefore, Ti 3 SiC 2 is a potential promising candidate for SiC and/or SiC matrix composites joining layer materials …”

Section: Introductionmentioning

confidence: 99%

See 4 more Smart Citations

Residual thermal stress of SiC/Ti₃SiC₂/SiC joints calculation and relaxed by postannealing

Zhou

et al. 2018

Int J Applied Ceramic Tech

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Residual thermal stresses in SiC/Ti3SiC2/SiC joining couples were calculated by Raman spectra and simulated by finite element analysis, and then relaxed successfully by postannealing. The results showed that the thermal residual stress between Ti3SiC2 and SiC was about on the order of 1 GPa when cooling from 1300°C to 25°C. The thermal residual stresses can be relaxed by the recovery of structure disorders during postannealing. When the SiC/Ti3SiC2/SiC joints postannealed at 900°C, the bending strength reached 156.9 ± 13.5 MPa, which was almost twice of the as‐obtained SiC/Ti3SiC2/SiC joints. Furthermore, the failure occurred at the SiC matrix suggested that both the flexural strength of joining layer and interface were higher than the SiC matrix.

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Section: Experimental and Computational Proceduresmentioning

confidence: 83%

Section: Experimental and Computational Proceduresmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Residual thermal stress of SiC/Ti₃SiC₂/SiC joints calculation and relaxed by postannealing

Zhou

et al. 2018

Int J Applied Ceramic Tech

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Interphases Formation and Analysis at the Lithium–Aluminum–Titanium–Phosphate (LATP) and Lithium–Manganese Oxide Spinel (LMO) Interface during High‐Temperature Bonding

Levit

Shvartsev

et al. 2020

Energy Tech

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In this study, fabrication processes of solid electrolyte/cathode interfaces for their use in next‐generation all‐solid‐state lithium‐ion battery (LIB) applications are described. Standard lithium–aluminum–titanium–phosphate (LATP) solid electrolyte and lithium–manganese oxide (LMO) spinel cathode ceramic half cells are assembled using two all‐solid‐state methods: a) co‐sintering the cathode and electrolyte materials via field‐assisted sintering and b) field‐assisted high‐temperature bonding. The morphology and composition of the interfaces are analyzed by scanning electron microscopy (SEM) and energy‐dispersive X‐ray spectroscopy (EDS). This study reveals that the formation of interphases can be significantly decreased by separately performing the densification and joining procedures. Electrochemical impedance spectroscopy (EIS) is applied to understand and determine the effect of the manufactured interfaces on the system conductivity. Based on the results, it is concluded that the high‐temperature bonding technique appears to be a suitable technique for future production of all‐solid‐state LIBs.

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Sintering and Joining of Ni-Based Superalloys via FAST for Turbine Disc Applications

Lin

Niuman

Kulkarni

et al. 2019

Metall Mater Trans A

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Fast joining SiC ceramics with Ti3SiC2 tape film by electric field-assisted sintering technology

Cited by 67 publications

References 38 publications

Residual thermal stress of SiC/Ti₃SiC₂/SiC joints calculation and relaxed by postannealing

Residual thermal stress of SiC/Ti₃SiC₂/SiC joints calculation and relaxed by postannealing

Interphases Formation and Analysis at the Lithium–Aluminum–Titanium–Phosphate (LATP) and Lithium–Manganese Oxide Spinel (LMO) Interface during High‐Temperature Bonding

Sintering and Joining of Ni-Based Superalloys via FAST for Turbine Disc Applications

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Fast joining SiC ceramics with Ti3SiC2 tape film by electric field-assisted sintering technology

Cited by 67 publications

References 38 publications

Residual thermal stress of SiC/Ti3SiC2/SiC joints calculation and relaxed by postannealing

Residual thermal stress of SiC/Ti3SiC2/SiC joints calculation and relaxed by postannealing

Interphases Formation and Analysis at the Lithium–Aluminum–Titanium–Phosphate (LATP) and Lithium–Manganese Oxide Spinel (LMO) Interface during High‐Temperature Bonding

Sintering and Joining of Ni-Based Superalloys via FAST for Turbine Disc Applications

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Residual thermal stress of SiC/Ti₃SiC₂/SiC joints calculation and relaxed by postannealing

Residual thermal stress of SiC/Ti₃SiC₂/SiC joints calculation and relaxed by postannealing