Fast laser writing technique for laser assisted selective electroless copper deposition on dielectrics surface for in-mold electronics applications

Ratautas, Karolis; Vosylius, Vytautas; Stankevičienė, Ina; Jagminienė, Aldona; Norkus, Eugenijus; Račiukaitis, Gediminas

doi:10.1117/12.2574913

Cited by 1 publication

(2 citation statements)

References 0 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…For three-dimensional applications, on the other hand, there are a number of laser-based technologies that can be implemented. These include Laser Metal Deposition (LMD) [ 4 , 5 , 6 ], Laser Direct Writing (LDW) [ 7 , 8 , 9 , 10 ], Laser-Induced Forward Transfer (LIFT) [ 11 , 12 ], Laser-Induced Selective Activation (LISA) [ 13 , 14 ], Laser Direct Structuring (LDS) [ 15 , 16 , 17 ], and Selective Surface Activation Induced by Laser (SSAIL) [ 18 , 19 , 20 , 21 , 22 , 23 ]. Table 1 summarizes selected methods with their individual characteristics.…”

Section: Introductionmentioning

confidence: 99%

“…Demonstrators for three-dimensional applications have already been shown. The application of laser pulses in the range of several picoseconds was reported by Ratautas et al and Camargo et al The laser sources allow higher precision, higher contrast, and negligible heat input during the patterning of the polymeric surface [ 16 , 18 , 19 , 20 , 21 , 22 , 23 , 33 , 34 , 35 , 41 ]. However, to the best of the authors’ knowledge, the parameter accumulated fluence has not been investigated, and thus, no correlation between the activation of the surface and copper plating has been established.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Modification of Polymeric Surfaces with Ultrashort Laser Pulses for the Selective Deposition of Homogeneous Metallic Conductive Layers

et al. 2022

View full text Add to dashboard Cite

In recent years, the demand for highly integrated and lightweight components has been rising sharply, especially in plastics processing. One strategy for weight-saving solutions is the development of conductive tracks and layouts directly on the polymer housing parts in order to be able to dispense with the system integration of additional printed circuit boards (PCB). This can be conducted very advantageously and flexibly with laser-based processes for functionalizing polymer surfaces. In this work, a three-step laser-based process for subsequent selective metallization is presented. Conventional injection molded components without special additives serve as the initial substrate. The Laser-Based Selective Activation (LSA) uses picosecond laser pulses to activate the plastic surface to subsequently deposit palladium. The focus is on determining the amount of deposited palladium in correlation to the laser and scan parameters. For the first time, the dependence of the metallization result on the accumulated laser fluence (Facc) is described. The treated polymer parts are characterized using optical and scanning electron microscopy as well as a contact-type profilometer.

show abstract