Fast screen printing and curing process for silicon heterojunction solar cells

Erath, D.; Pingel, S.; Khotimah, Retno; Rose, Angela De; Eberlein, D.; Wenzel, Timo; Roder, Sebastian; Lorenz, Andreas; Clement, Florian

doi:10.1063/5.0056429

Cited by 11 publications

(3 citation statements)

References 2 publications

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“…Curing of low-temperature paste for SHJ solar cells includes two routes: lowtemperature rapid curing (<220 °C, 5-10 min, in air) and lowtemperature typical curing (<220 °C, ∼30 min, in air). [59][60][61] The solid-state dewetting resistance of Cu@Ag powders was evaluated by simulating the low-temperature curing process of SHJ solar cells, and XRD patterns were used to characterize whether the Cu cores were oxidized. As can be seen from Fig.…”

Section: Solid-state Dewetting Resistance Of the Tetradecahedralmentioning

confidence: 99%

Tetradecahedral Cu@Ag core–shell powder with high solid-state dewetting and oxidation resistance for low-temperature conductive paste

Zeng,

Zou,

Chen

et al. 2024

J. Mater. Chem. A

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Section: Solid-state Dewetting Resistance Of the Tetradecahedralmentioning

confidence: 99%

Tetradecahedral Cu@Ag core–shell powder with high solid-state dewetting and oxidation resistance for low-temperature conductive paste

Zeng,

Zou,

Chen

et al. 2024

J. Mater. Chem. A

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“…3,12 Typically, lateral electrode resistivity below ρ lateral ≤ 15 μΩÁcm have been achieved with those paste formulations. 7,13,14 On R&D level, low-temperature curing pastes are applied by flatbed screen printing, 6,15 rotary printing, 16 inkjet printing, 17 and dispensing technique. 18,19 Nevertheless, flatbed screen printing remains the common industrial technique to create printed contacts on silicon solar cells.…”

Section: Introductionmentioning

confidence: 99%

Curing conditions for low‐resistivity contacts on transparent conductive oxide layers for different solar cell applications

Gensowski,

Freund,

Much

et al. 2023

Progress in Photovoltaics

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The Cu (ln1‐xGax)Se2 (CIGS) solar cell technology is a potentially high‐efficient approach with unique properties compared with silicon photovoltaic, like flexible lightweight substrates and different colored designs. So far, the full potential of the transparent conductive oxide layers has not been exploited yet as no front contacts are applied, resulting in significant losses from the cell‐to‐module level. In this study, Ag front contacts are applied by parallel dispensing onto indium tin oxide layers of silicon heterojunction substrates and CIGS substrates. Subsequently, a thermally curing process is carried out to form the conductive contacts. The curing conditions are varied between 200°C ≥ Tc ≥ 100°C combined with 20 min ≥ tc ≥ 1.5 min. The study aims to determine the curing parameters enabling low‐resistivity contacts by using low‐temperature curing Ag paste and ultralow‐temperature curing Ag paste. The lateral electrode resistance and the contact resistivity of printed electrodes are measured. The results of simultaneous thermogravimetry‐differential scanning calorimetry (pastes) and microstructure analysis of printed electrodes are used to explain the electrical parameters of the printed electrodes. In general, higher curing temperatures and longer curing durations encourage the sintering and densification process of the applied electrodes resulting in low‐resistivity contacts. Contact resistivities below ρc,TLM < 5 mΩ·cm2 and lateral electrode resistance of Rlateral ≥ 17 Ω m−1 are obtained for different paste systems. However, optimal curing conditions of low‐temperature curing pastes can cause thermal damage to the CIGS device. Therefore, ultralow‐temperature curing pastes seem to be promising candidates for front contact metallization of CIGS substrates.

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“…High throughput rates and low silver consumption per SHJ cell are requirements to increase the market share of this high-efficiency solar cell concept. Erath et al recently published applicable flooding and printing velocities of up to v = 400 mm s −1 for flatbed screen printing 10 . Descoeudres et al presented a w f = 16 µm wide, screen-printed Ag-electrode by using a special, knotless screen with screen openings of w n = 12 µm 11 .…”

Section: Introductionmentioning

confidence: 99%

Filament stretching during micro-extrusion of silver pastes enables an improved fine-line silicon solar cell metallization

Gensowski

Much

Bujnoch

et al. 2022

Sci Rep

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The metallization of heterojunction solar cells requires a further reduction of silver consumption to lower production costs and save resources. This article presents how filament stretching of polymer-based low-temperature curing Ag pastes during micro-extrusion enables this reduction while at the same time offering a high production throughput potential. In a series of experiments the relationship between the printing velocity and the filament stretching, thus the reduction of Ag-electrode widths and Ag laydown is evaluated. Furthermore, an existing filament stretching model for the parallel dispensing process is advanced further and utilized to calculate the elongational viscosity. The stretching effect enables a reduction of the Ag-electrode width by down to Δwf = − 40%rel. depending on the nozzle diameter and paste type. The Ag laydown has been reduced from mAg,cal. = 0.84 mg per printed line to only mAg,cal. = 0.54 mg per printed Ag-electrode when 30 µm nozzle openings are used, demonstrating the promising potential of parallel dispensing technology for the metallization of silicon heterojunction solar cells.

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Fast screen printing and curing process for silicon heterojunction solar cells

Cited by 11 publications

References 2 publications

Tetradecahedral Cu@Ag core–shell powder with high solid-state dewetting and oxidation resistance for low-temperature conductive paste

Tetradecahedral Cu@Ag core–shell powder with high solid-state dewetting and oxidation resistance for low-temperature conductive paste

Curing conditions for low‐resistivity contacts on transparent conductive oxide layers for different solar cell applications

Filament stretching during micro-extrusion of silver pastes enables an improved fine-line silicon solar cell metallization

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