2018
DOI: 10.1088/1361-6528/aae3df
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Fast turnaround fabrication of silicon point-contact quantum-dot transistors using combined thermal scanning probe lithography and laser writing

Abstract: The fabrication of high-performance solid-state silicon quantum-devices requires high resolution patterning with minimal substrate damage. We have fabricated room temperature (RT) singleelectron transistors (SETs) based on point-contact tunnel junctions using a hybrid lithography tool capable of both high resolution thermal scanning probe lithography and high throughput direct laser writing. The best focal z-position and the offset of the tip-and the laser-writing positions were determined in situ with the sca… Show more

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Cited by 23 publications
(21 citation statements)
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“…To overcome this barrier, the technology is being pushed towards hybrid thermal lithography where the benefits of fast laser-writing and high-resolution t-SPL are combined in a single tool: large areas of a temperaturesensitive resist can be rapidly modified with a laser and the areas of the same sample that require high resolution can be patterned by t-SPL using the same resist 43,62 . The development of new t-SPL systems with multiple cantilevers that can be simultaneously actuated is also ongoing and proof-of-principle experiments with linear arrays of up to ten cantilevers have been demonstrated 42,62 .…”
Section: Discussionmentioning
confidence: 99%
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“…To overcome this barrier, the technology is being pushed towards hybrid thermal lithography where the benefits of fast laser-writing and high-resolution t-SPL are combined in a single tool: large areas of a temperaturesensitive resist can be rapidly modified with a laser and the areas of the same sample that require high resolution can be patterned by t-SPL using the same resist 43,62 . The development of new t-SPL systems with multiple cantilevers that can be simultaneously actuated is also ongoing and proof-of-principle experiments with linear arrays of up to ten cantilevers have been demonstrated 42,62 .…”
Section: Discussionmentioning
confidence: 99%
“…Similarly, using multiple tips in parallel ultimately could overcome the throughput limit for t-SPL 13,42 . Another strategy to increase throughput for applications that require microscale and nanoscale structures is to combine a high-resolution thermal scanning probe with a fast integrated laser writer in a single tool 43 .…”
Section: Challenges In T-splmentioning
confidence: 99%
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“…In horizontal direct writing, the sample is moved perpendicularly to the laser beam. This method is commonly used to fabricate surface structures [9,44]. In vertical direct writing, the sample is moved along the direction of laser beam irradiation.…”
Section: Femtosecond Laser Direct Writing Fabricationmentioning
confidence: 99%