2001
DOI: 10.1007/s11664-001-0053-8
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Fatigue crack growth behavior in 63Sn-37Pb and 95Pb-5Sn solder materials

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Cited by 13 publications
(6 citation statements)
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“…The results of the studies on the fatigue crack-growth behavior of lead-tin solder indicate that the fatigue crack growth involves creep-fatigue interactions. 8,9 Room temperature for Sn-based lead-free solders also corresponds to high homologous temperatures like lead-tin solder. Therefore, it is of importance to investigate the role of creep deformation during fatigue-crack growth in these solders.…”
Section: Introductionmentioning
confidence: 99%
“…The results of the studies on the fatigue crack-growth behavior of lead-tin solder indicate that the fatigue crack growth involves creep-fatigue interactions. 8,9 Room temperature for Sn-based lead-free solders also corresponds to high homologous temperatures like lead-tin solder. Therefore, it is of importance to investigate the role of creep deformation during fatigue-crack growth in these solders.…”
Section: Introductionmentioning
confidence: 99%
“…SEM micrographs of (a) 95Pb–5Sn solder (Zhao et al , 2000), (b) 63Sn–37Pb solder at low magnification (Zhao et al , 2001b), (c) 63Sn–37Pb solder at high magnification, (d) Sn–3.5Ag solder, showing Sn‐dendrite phases, (e) Sn–3.5Ag solder, showing eutectic structure of Sn and plate like Ag 3 Sn (Zhao et al , 2001a), (f) Sn–3Ag–0.5Cu solder (Zhao et al , 2002), (g) Sn–3Ag–0.5Cu–1Bi solder (Zhao et al , 2002), and (h) Sn–3Ag–0.5Cu–3Bi solder (Zhao et al , 2002)…”
Section: Figurementioning
confidence: 99%
“…Relationship between (a) d a /d N – Δ J (Zhao et al , 2001b), and (b) d a /d t – C * for 63Sn–37Pb solder…”
Section: Figurementioning
confidence: 99%
“…Logsdon et al (9) related the fatigue crack growth rate of Sn-Pb eutectic solder with ∆K, and found that the ∆K failed to discuss the effect of time-dependent process. Zhao et al (10,11) also found that linear-elastic fracture mechanics parameter (K max ) was not valid in the region of time-dependent crack growth for 63Sn-37Pb and 5Sn-95Pb solders under cyclic loading. Kanchanomai et al (12) studied the crack growth (CG) behavior of Sn-Ag eutectic solder under cyclic loading and found that the ∆J could not characterize the CG rate (da/dN) for wide range of frequencies, i.e.…”
Section: Introductionmentioning
confidence: 99%