2005
DOI: 10.1007/bf03027493
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Fatigue crack growth in 2024 aluminum alloy with inhomogeneous solidification microstructure

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Cited by 6 publications
(3 citation statements)
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“…In order to systematically understand correlations between mechanical properties, fracture toughness, and microstructure, fracture mechanisms related with microstructures should be elucidated. A simple method used to investigate microfracture mechanisms is a phenomenological observation of fractured surfaces, and other experiments such as direct observation of crack initiation and propagation processes [7][8][9] and microscopic observation of deformed or fractured microstructures [10] have been conducted. The scope of the microfracture mechanism study has been extended as electron microscopes are widely used [11].…”
Section: Introductionmentioning
confidence: 99%
“…In order to systematically understand correlations between mechanical properties, fracture toughness, and microstructure, fracture mechanisms related with microstructures should be elucidated. A simple method used to investigate microfracture mechanisms is a phenomenological observation of fractured surfaces, and other experiments such as direct observation of crack initiation and propagation processes [7][8][9] and microscopic observation of deformed or fractured microstructures [10] have been conducted. The scope of the microfracture mechanism study has been extended as electron microscopes are widely used [11].…”
Section: Introductionmentioning
confidence: 99%
“…Aluminum alloys are commonly used in the automobile, electronic, computer industries and aircraft structural applications as they present relatively high strength-to-weight ratio, high toughness combined with good formability and weld-ability [1]. However, the application has been limited because of its bad corrosion resistance.…”
Section: Introductionmentioning
confidence: 99%
“…Several authors 1–5 have concentrated on fatigue crack growth (FCG) studies of different aluminium alloys. Various microstructural features such as Si morphology, secondary dendrite arm spacing (DAS) as well as heat treatment, porosity level, testing conditions, operating atmospheres, operating temperature, etc.…”
Section: Introductionmentioning
confidence: 99%