Fatigue damage mechanisms of copper single crystal/Sn–Ag–Cu interfaces

Zhu

Journal of Alloys and Compounds

2008

Section: Methodssupporting

confidence: 88%

Growth kinetics of intermetallic compounds and tensile properties of Sn–Ag–Cu/Ag single crystal joint

Zhu

Journal of Alloys and Compounds

2008

“…Some of the soldered samples were isothermally aged for 4 days and 16 days at a temperature of 180°C. 14,15 After that, both the as-reflowed and aged samples were spark-cut into tensile and fatigue specimens, and the side surfaces were firstly ground with 2000# SiC abrasive paper and then carefully polished with 1 lm diamond powder for the microstructural observations of the solder/Cu interface. The dimensions of tensile and fatigue specimens are presented in Fig.…”

Section: Methodsmentioning

confidence: 99%

“…In particular, there have been very limited studies on the fatigue behavior of solder/substance interfaces, which is more valuable in practice. 14,15 Therefore, in order to obtain some reliable fatigue data about solder/substance interfaces and to have a better understanding of the mechanisms of interfacial fatigue damage, we systematically investigated the behaviors of tensile and stress-controlled fatigue fractures of Cu/Sn-4Ag solder joints aged at 180°C. Furthermore, it is expected that this research may provide a new approach for reliability evaluation of the Cu/solder interfaces.…”

Section: Introductionmentioning

confidence: 99%

Tensile and Fatigue Behaviors of Aged Cu/Sn-4Ag Solder Joints

2009

Journal of Elec Materi

Tensile properties and stress-controlled fatigue fracture behaviors of Cu/Sn-4Ag solder joints aged at 180°C for different times were systematically investigated. It was found that the tensile strength of the solder joints decreased with increasing aging time and that the fracture mode changed from ductile to brittle. The fatigue life of the solder joints also decreased with increasing aging time. For most of the solder joints, fatigue cracks tended to initiate around the Cu/Cu 6 Sn 5 interfaces due to the strain incompatibility and local strain concentration on a micro-scale, and they then propagated within the solder proximately along the Cu/Cu 6 Sn 5 interfaces. The samples aged for different times or tested under different stress amplitudes had similar fractography morphologies, which consisted mainly of a propagation region, covered by solder, and a final fracture region. Based on the experimental observations above, the corresponding interfacial fatigue failure mechanisms were discussed in terms of different influencing factors.

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“…However, for the Sn-4Ag-3Zn couple, the IMC growth mechanism is approximately parabolic, which is similar to most interfacial reactions. 41,42 For the Sn-4Ag-3Zn and Sn-4Ag-7Zn solders, Ag-Zn IMCs were often formed at the interface in the initial stage during the reflow procedure. However, with extended aging time, the Ag-Zn IMC was transformed into Ag 59 Zn 29 Sn 12 .…”

Section: Growth Kinetics Of Imcsmentioning

confidence: 99%

Effect of Zn Addition on Interfacial Reactions Between Sn-4Ag Solder and Ag Substrates

2008

Journal of Elec Materi

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