Fatigue fracture mechanisms of Cu/lead-free solders interfaces

Zhang, Qingke; Zhu, Qing–Ling; Zou, Hui; Zhang, Z.F.

doi:10.1016/j.msea.2009.10.040

Cited by 45 publications

(15 citation statements)

References 29 publications

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“…There are many kinds of lead-free solders available in different manufacturing processes, such as Sn-Ag-Cu, Sn-Ag, SnCu, Sn-Zn and Sn-Au solder. Commonly used in wave and reflow soldering processes, these lead-free solders have a much higher melting temperature, comparing with Sn37Pb solder whose melting point is around 183°C [1][2][3]. Therefore, the utilization of lead-free technology inevitably raises the cost of manufacturing and damages the hightemperature-sensitive print circuit boards and components.…”

Section: Introductionmentioning

confidence: 99%

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Sun

Chan

2014

J Mater Sci: Mater Electron

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Sn-Bi solder was proposed as one of the most promising substitutes for lead solder due to its lower melting temperature, good wettability, good yield strength and cost efficiency. With Ag elements added, the mechanical properties of Sn-Bi solder were improved obviously. There are two ways that are commonly used to add the reinforced particles into the solder. The first way (Way I) is to blend the reinforced particles with solder powders together, and then followed by pressure forming, sintering, cooling, crystallization and serious machining methods under inert atmosphere to make the solder paste. Another way (Way II) is to directly add the reinforced nano or micro particles into the solder paste by sufficient mechanical-stirring. In this research we would like to get fully understanding on the effects of these two ways of Ag addition on the mechanical properties of Sn-Bi-Ag solder joints during aging. Sn57.6Bi0.4Ag solder stands for the Way I and the doped Sn58Bi ? 0.4Ag solder stands for the Way II. These two kinds of joints were compared via micromorphology observation, thermal failure analyses as well as balls shear strength measurement after different aging time (under 100°C, from 0 to 800 h). The mechanical properties of Sn57.6Bi0.4Ag and the doped Sn58Bi ? 0.4Ag solder joints during aging were shown to be associated with the changes of micromorphology, the dissolution of IMCs, as well as the flatness of the joints' interface. Before long-time aging, the doped Sn58Bi ? 0.4Ag solder joints showed better mechanical performance than Sn57.6Bi0.4Ag solder joints. During aging, Sn56.7Bi0.4Ag solder joints had better performance in preventing the dissolution of Ni-Sn IMCs into the solder side, having smoother interfaces, comparing with Sn58Bi ? 0.4Ag solder joints. The degenerated phenomenon of Ag nanoparticle reinforcement seriously happened in the doped Sn58Bi ? 0.4Ag solder joints. After longtime aging, Sn57.6Bi0.4Ag solder joints had better mechanical properties than the doped Sn58Bi ? 0.4Ag solder joints.

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Section: Introductionmentioning

confidence: 99%

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Sun

Chan

2014

J Mater Sci: Mater Electron

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“…for ball grid array, or small components soldering on PCB boards [7][8][9][10][11][12][13][14]. Therefore, these studies do not reflect the large soldering area and the different materials encountered in IGBT modules.…”

Section: Introductionmentioning

confidence: 99%

Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

Dugal

Ciappa

2014

Microelectronics Reliability

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“…8 Despite the advantages and extensive research performed on these solders to date, Sn-58Bi solder has an inherent drawback, i.e., its reliability declines as a function of thermal history. [21][22][23][24][25][26][27] Additionally, Sn-52In solder is expensive. Accordingly, Sn-3Ag-0.5Cu solder has been recommended by the Japan Electronics and Information Technology Industries Association (JEITA), and is widely used in FC interconnections.…”

Section: Introductionmentioning

confidence: 99%

Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

Miyauchi

Yamashita

Suzuki

et al. 2014

Journal of Elec Materi

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The self-assembly of solder powder on pads is attractive as a novel interconnection method between chips and substrates. However, the solder used in this method is limited to Sn-58Bi and Sn-52In. In contrast, Sn-3Ag-0.5Cu has been relatively less studied despite its wide use as a lead-free solder in assembling semiconductor packages. Hence, here, polymeric materials incorporating Sn-3Ag-0.5Cu solder powder were investigated for the self-assembly of the solder on pads at temperatures up to 260°C in a lead-free reflow process. The self-assembly of the solder was observed with an optical microscope through transparent glass chips placed on substrates covered with the polymeric materials incorporating the solder powder. Differential scanning calorimetry measurements were performed to confirm the behaviors of the reaction of the resins and the melting of the solder. When epoxy resin with a fluxing additive was used as a matrix, self-assembly of the solder was prevented by the cross-linking reaction. Conversely, when thermoplastic resin containing carboxyl groups was used as a matrix, the self-assembly of solder was successfully achieved in the absence of fluxing additives. The shear strength of interconnection using reflowfilm with lamination was sufficient and significantly increased during the reflow process. However, the shear strength of the reflowfilm showed cohesive failure, possibly because of the brittle intermetallic compounds (Ag 3 Sn, Au 4 Sn) network in bulk was lower than that of conventional solder paste that showed interfacial failure after the reflow process with a rapid cooling rate.

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Fatigue fracture mechanisms of Cu/lead-free solders interfaces

Cited by 45 publications

References 29 publications

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

A study of Ag additive methods by comparing mechanical properties between Sn57.6Bi0.4Ag and 0.4 wt% nano-Ag-doped Sn58Bi BGA solder joints

Study of thermal cycling and temperature aging on PbSnAg die attach solder joints for high power modules

Self-assembly of Sn-3Ag-0.5Cu Solder in Thermoplastic Resin Containing Carboxyl Group and its Interconnection

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